LED Assembly with Vented Circuit Board
A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.
1 . A circuit board LED display assembly, comprising:
a plurality of LEDs having a dome, the LEDs being disposed in a grid pattern at junctions, the junctions being connected by bridges defining air vents through which air can flow through the printed circuit board assembly;
the bridges formed from a substrate for activating the LEDs, the substrate having a first side including the LEDs and an opposing a second side; and
a plurality of aerodynamic members configured to reduce air pressure, the aerodynamic members being disposed on the second side of the substrate corresponding to the junctions.
2 . The circuit board LED display assembly according to claim 1 , wherein the substrate comprises a multilayered substrate having a thermal cooling layer in thermal communication with the LEDs.
3 . The circuit board LED display assembly according to claim 2 , wherein the multilayered substrate includes an insulating layer over the thermal cooling layer; and insulating layer having a plurality of openings configured for air communication with the thermal cooling layer.
4 . The circuit board LED display assembly according to claim 3 , wherein said openings are disposed in a sidewall of the bridges for exposing a portion of the thermal cooling layer.