Chip card for insertion into a holder
The invention relates to a chip card (CC), in particular a SIM card, inserted for operation into a holder (HH), which holder (HH) is equipped with electrical device contacts (GK) and a press-on device (AE). The chip card (CC) comprises a substrate (S), a contact field (K), a chip (C), and a single-piece encapsulation (V). According to the invention, the encapsulation (V) has a thickness (dV) which ensures that, on insertion of the chip card (CC), the encapsulation (V) has body contact with the press-on device (AE), the contact field (K) has body contact with the device contacts (GK), and the contact field (K) is reliably electrically contacted to the device contacts (GK). No further carrier material (T) is provided.
1. A chip card for insertion into an electronic device that is provided with a holder, which holder is equipped with electrical device contacts and a press-on device, the chip card comprising:
an electrically insulating planar substrate with a first major surface, an opposing second major surface, and a perimeter edge surface;
a metallic planar contact field applied to the first major surface of the electrically insulating planar substrate;
a chip located on the second major surface of the electrically insulating planar substrate and electrically connected to the metallic planar contact field; and
a single-piece injection molded encapsulation located on the second major surface of the electrically insulating planar substrate and enclosing the chip, wherein the single-piece injection molded encapsulation is a monolithic structure that is located directly on the chip and on the second major surface of the of the electrically insulating planar substrate to form a solid structure that is free of a cavity;
wherein the single-piece injection molded encapsulation, with no further encapsulation material required, has such a thickness that, on insertion of the chip card into the holder, the single-piece injection molded encapsulation has body contact with the press-on device of the holder, the contact field has body contact with the device contacts of the holder, and the contact field is reliably electrically contacted to the device contacts of the holder;
wherein a top base surface of the single-piece injection molded encapsulation is at least as large as the contact field without projecting beyond the perimeter edge of the substrate; and
wherein the perimeter edge of the substrate projects beyond a perimeter edge of the single-piece injection molded encapsulation and beyond a perimeter edge of the contact field.
2. A chip card as claimed in claim 1 , characterized in that the single-piece injection molded encapsulation in the region of the contact field has such a base surface that the contact field is reliably contacted to the device contacts on insertion of the chip card.
3. A chip card as claimed in claim 1 , characterized in that the substrate has holes leading from the first to the second surface and the single-piece injection molded encapsulation extends into these holes.
4. A chip card as claimed in claim 1 , characterized in that its external dimensions correspond to those of a SIM card for a mobile phone.
5. A chip card as claimed in claim 1 , characterized in that at least one further chip is arranged next to the chip located on the second surface, the single-piece injection molded encapsulation enclosing all chips.
6. A chip card as claimed in claim 1 , wherein the chip card includes at least two further chips and characterized in that at least one of the two further chips is designed as a processor and at least one of the two further chips is designed as a memory.
7. A chip card as claimed in claim 1 , characterized in that it has at least one direction of insertion and the single-piece injection molded encapsulation has a shape which simplifies insertion in said direction.
8. A chip card as claimed in claim 1 , characterized in that it has at least one direction of insertion and the single-piece injection molded encapsulation has a shape which prevents insertion against said direction of insertion.
9. An arrangement of several chip cards as claimed in claim 1 , characterized in that they are located on a common substrate and the single-piece injection molded encapsulations of the individual chip cards are so spaced that the chip cards are easy separable.
10. An arrangement as claimed in claim 9 , characterized in that the substrate is provided with perforations between the single-piece injection molded encapsulations of the individual chip cards.
11. A chip card as claimed in claim 1 , characterized in that at least one further chip is arranged within the chip card, the one further chip comprising a near field communication (NFC) chip.
12. An chip card as claimed in claim 1 , characterized in that at least one further chip is arranged above the chip located on the second surface, the single-piece injection molded encapsulation enclosing all chips.
13. An chip card as claimed in claim 1 , characterized in the substrate projects beyond the perimeter edge of the single-piece injection molded encapsulation by approximately 0.2 mm.