Semiconductor device
View Patent ↗A semiconductor device has an improved mounting reliability and has external terminals formed by exposing portions of leads from a back surface of a resin sealing member. End portions on one side of the leads are fixed to a back surface of a semiconductor chip, and portions of the leads positioned outside the semiconductor chip are connected with electrodes formed on the semiconductor chip through wires.
1. A semiconductor device comprising:
a semiconductor chip having over a main surface thereof an integrated circuit and a plurality of electrodes, wherein a plane shape of said semiconductor chip is quadrangular;
a plurality of leads arranged around said semiconductor chip;
a plurality of wires adapted to connect the plurality of electrodes on said semiconductor chip with the plural leads; and
a resin sealing member adapted to seal said semiconductor chip, portions of said plural leads and said plural wires;
wherein a plane shape of the resin sealing member is quadrangular;
wherein the plural leads have plural first leads including first terminal portions, respectively, and plural second leads including second terminal portions, respectively, the plural second leads each being disposed between adjacent ones of said first leads;
wherein end portions on one side of each of the plural first leads are positioned outside said semiconductor chip;
wherein end portions on one side of each of the plural second leads are fixed along sides of a back surface of said semiconductor chip;
wherein the first terminal portions are arranged along side faces of the resin sealing member, respectively;
wherein the second terminal portions are arranged inside said first terminal portions, respectively; and
wherein the first terminal portions and the second terminal portions are arranged along sides of the resin sealing member in a staggered arrangement.
2. The semiconductor device according to claim 1 , wherein said semiconductor chip is fixed to the end portions on one side of each of the plural second leads through a base which has a main surface and a back side.
3. The semiconductor device according to claim 1 , wherein said wire is comprised of gold.