Method for manufacturing semiconductor device
View Patent ↗A manufacturing method is for providing an excellent wire bonding property in the manufacturing of a semiconductor device using an organic resin wiring substrate. In the manufacturing of the semiconductor device, a thermosonic wire bonding apparatus is used when the electrodes of a semiconductor element fixed to the principal surface of a substrate are connected to lines on the substrate with wires. To connect the first and second portions to be bonded of the substrate placed on a wire bonding stage with wires each held by a capillary, the wire bonding apparatus heats the capillary to a specified temperature by irradiating the capillary with a laser beam for a given period of time immediately before first bonding for connecting the wire to the first portion to be bonded and immediately before second bonding for connecting the wire to the second portion to be bonded and heats the portions of the wires to be bonded with the resulting heat, thereby connecting the wires to predetermined portions by using thermocompression and ultrasonic vibration.
1. A method for manufacturing a semiconductor device, comprising the steps of:
providing a wire bonding apparatus having a holder comprised of Al 2 O 3 , and a capillary held by said holder and comprised of Ti;
providing a semiconductor chip having a main surface, a back surface, and an electrode formed over said main surface;
providing a substrate having a line;
fixing said semiconductor chip onto said substrate;
heating said capillary covering a wire from therearound with a laser beam; and
electrically connecting the electrode of said semiconductor chip to said line through said wire by using said capillary.
2. A method according to claim 1 , wherein said capillary has a thermal conductivity lower than that of the holder.
3. A method according to claim 1 , wherein said substrate has a base material made of organic resin.
4. A method according to claim 1 , wherein said substrate is comprised of a Cu lead frame.