IP Library Granted Patent US 7,735,213
Granted Patent B2
US 7,735,213 · App. 11/845,010 · Granted Jun 15, 2010

Method for fabricating magnetic head slider

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Quick Facts
Patent No.
US 7,735,213
App. No.
11/845,010
Granted
Jun 15, 2010
Kind
B2
Abstract

Embodiments of the present invention provide a method of fabricating a magnetic head slider realizing high-recording density at high-yields by preventing formation of a short circuit on the air-bearing surface of a magnetic head slider and preventing formation of an oxidized layer with significant film thickness which increases the effective magnetic spacing, on the air-bearing surface of the magnetic head slider. According to one embodiment, after air-bearing surface mechanical lapping of a row bar or a magnetic head slider, cleaning is performed by ion beam bombardment to remove a conductive smear. Oxygen exposure is performed to recover a damaged region which was formed by ion beam bombardment at the end face of an intermediate layer of a magnetoresistive film 5 . Thereafter, air-bearing surface protection films are formed and followed by rail formation. If the processes are performed on the row bar, the row bar is cut into individual separated magnetic head sliders.

Claims (31)

1. A method of fabricating a magnetic head element, comprising the steps of:

forming a plurality of magnetic head elements each having a magnetoresistive film on a wafer;

cutting the wafer into row bars;

cutting each of the row bars for every magnetic head element into separated magnetic head sliders;

mechanically lapping an air-bearing surface of the magnetic head slider;

cleaning the mechanically lapped air-bearing surface by using an ion beam or gas plasma;

exposing the cleaned air-bearing surface to gas;

forming a protection film on the air-bearing surface exposed to the gas; and

forming a rail on the air-bearing surface on which the protection film is formed.

2. The method according to claim 1 , wherein the gas is an oxygen-containing gas.

3. The method according to claim 2 , wherein the product of time for introducing the oxygen-containing gas and oxygen partial pressure is not less than 0.005 Pa·sec and not greater than 3 pa·sec.

4. The method according to claim 1 ,

wherein the magnetoresistive film includes an intermediate layer, a free layer formed on one laminated layer surface side of the intermediate layer, and a pinned layer formed on the other laminated layer surface side of the intermediate layer; and

wherein the intermediate layer is a tunnel barrier layer.

5. The method according to claim 1 ,

wherein the magnetoresistive film includes an intermediate layer, a free layer formed on one laminated layer surface side of the intermediate layer, and a pinned layer formed on the other laminated layer surface side of the intermediate layer; and

wherein the intermediate layer is a current confined layer formed of a portion having relatively high resistance and another portion having relatively low resistance.

6. A method of fabricating a magnetic head slider, comprising the steps of:

forming a plurality of magnetic head elements each having a magnetoresistive film on a wafer;

cutting the wafer into row bars;

mechanically lapping an air-bearing surface of each of the row bars;

cleaning the mechanically lapped air-bearing surface by using an ion beam or gas plasma;

forming a first protection film on the cleaned air-bearing surface;

forming a rail on the air-bearing surface on which the first protection film is formed;

removing the first protection film;

cleaning, using an ion beam or gas plasma, the air-bearing surface from which the first protection film was removed;

exposing the second cleaned air-bearing surface to gas;

forming a second protection film on the air-bearing surface exposed to the gas; and

cutting the row bar for every magnetic head element.

7. The method according to claim 6 , wherein the gas is an oxygen-containing gas.

8. The method according to claim 7 , wherein the product of time for introducing the oxygen-containing gas and oxygen partial pressure is not less than 0.005 Pa·sec and not greater than 3 pa·sec.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2016
From: HGST NETHERLANDS B.V.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 040821/0550 →
CHANGE OF NAME Recorded Oct 25, 2012
From: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
To: HGST NETHERLANDS B.V.
Reel/Frame 029341/0777 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 4, 2007
From: YASUI, NUBUTO; WATANABE, KATSURO; SEKI, TAKATERU; MIYATA, KAZUHITO; MATSUSAKI, TETSUYA
To: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
Reel/Frame 020192/0841 →