Mobile wireless communications device with reduced interfering RF energy into RF metal shield secured on circuit board

1. A mobile wireless communications device, comprising:

a housing;

RF circuitry mounted within the housing and comprising at least one RF component and plurality of other components;

an RF metal shield surrounding and isolating said at least one RF component and plurality of other components within said RF metal shield, said RF metal shield having an RF absorber formed as an opening within the RF shield and positioned adjacent an area of the RF component that radiates energy, wherein said opening is configured to aid in reducing energy radiated from the RF component into the RF metal shield and causing electromagnetic coupling or interference with other portions of said RF component or other components within said RF metal shield.

2. A mobile wireless communications device according to claim 1 , wherein said RF absorber further comprises an RF absorbing material positioned at the opening of the RF metal shield.

3. A mobile wireless communications device according to claim 2 , wherein said RF absorbing material comprises a ferrite material.

4. A mobile wireless communications device according to claim 3 , wherein said RF absorbing material comprises a planar sheet.

5. A mobile wireless communications device according to claim 4 , and further comprising an adhesive tape securing to said RF metal shield said planar sheet that forms said RF absorbing material.

6. A mobile wireless communications device according to claim 1 , wherein said RF absorber as an opening is formed as a longitudinal slot positioned over the area of the RF component that radiates energy.

7. A mobile wireless communications device according to claim 1 , wherein said at least one RF component comprises an RF chip set.

8. A mobile wireless communications device according to claim 7 , wherein said RF chip set comprises a transceiver chip set.

9. A mobile wireless communications device according to claim 8 , wherein said chip set comprises a transmitter chip, receiver chip and local oscillator chip.

10. A mobile wireless communications device according to claim 9 , wherein said RF absorber is positioned adjacent said transmitter chip.

11. A mobile wireless communications device according to claim 1 , wherein said RF circuitry is operative for generating Global System for Mobile (GSM) communications packet bursts.

12. A method for making a mobile wireless communications device, which comprises:

providing a housing, radio frequency (RF) circuitry including at least one RF component and other components mounted within the housing and a RF metal shield surrounding and isolating said at least one RF component and other components within said RF metal shield; and

reducing energy radiated from a portion of an RF component into the RF metal shield to reduce the electromagnetic coupling or interference with other portions of said RF component or other components enclosed by said RF metal shield by positioning an RF absorber formed as an opening adjacent the area of the RF component that radiates energy and configured to reduce the electromagnetic coupling or interference.

13. A method according to claim 12 , which further comprises forming the at least one RF component as an RF chip set.

14. A method according to claim 12 , which further comprises forming a longitudinal slot within the RF metal shield over the portion of the at least one RF component that radiates energy.

15. A method according to claim 12 , which further comprises positioning an RF absorbing material at the opening.

16. A method according to claim 15 , which further comprises forming the RF absorbing material as a ferrite material.