Current perpendicular to plane GMR and TMR sensors with improved magnetic properties using Ru/Si seed layers
View Patent ↗A magnetoresisive sensor having a thin seed layer that provides an exceptionally smooth interface between layers of the sensor stack. The exceptionally smooth interface provided by the seed layer reduces interlayer exchange coupling allowing the non-magnetic spacer layer (or barrier layer) to be very thin. The seed layer includes a thin layer of Ru and a thin layer of Si which intermix to form a homogeneous, amorphous thin seed layer of Ru-silicide.
1. A magnetoresistive sensor, comprising:
a magnetic pinned layer structure;
a magnetic free layer structure;
a non-magnetic layer sandwiched between the free layer and the pinned layer;
a layer of antiferromagnetic material exchange coupled with a layer of the pinned layer structure; and
a seed layer adjacent to the layer of antiferromagnetic material, the seed layer comprising Si and Ru that have intermixed to form an amorphous Ru-silicide.
2. A sensor as in claim 1 wherein the seed layer has a thickness of 4-6 Angstroms.
3. A sensor as in claim 1 wherein the seed layer comprises a, amorphous layer.
4. A sensor as in claim 1 wherein the seed layer comprises a layer of Ru having a thickness of 2-3 Angstroms and a layer of Si having a thickness of 2-3 Angstroms, and wherein the layers of Ru and Si have intermixed.
5. A sensor as in claim 1 wherein the non-magnetic layer comprises an electrically conductive layer having a thickness of 17 to 30 Angstroms.
6. A sensor as in claim 1 wherein the non-magnetic layer comprises a layer of Cu having a thickness of 17 to 30 Angstroms.
7. A sensor as in claim 1 wherein the non-magnetic layer comprises a layer of Cu—O having a thickness of 17 to 30 Angstroms.
8. A sensor as in claim 1 wherein the non-magnetic layer comprises an electrically insulating barrier layer.
9. A sensor as in claim 1 wherein the non-magnetic layer comprises an electrically insulating barrier layer having a thickness of 17-30 Angstroms.
10. A sensor as in claim 1 wherein the sensor is a current perpendicular to plane magnetoresistive sensor.
11. A sensor as in claim 1 wherein the layer of antiferromagnetic material comprises IrMn.
12. A sensor as in claim 1 wherein the seed layer comprises a layer of Ru-silicide and a layer of Ru.
13. A sensor as in claim 1 wherein the seed layer comprises a layer of Ru-silicide having a thickness of 4-6 Angstroms and a layer of Ru having a thickness of 10-15 Angstroms.
14. A method for manufacturing a magnetoresistive sensor, comprising:
providing a substrate;
depositing a layer of Ru;
depositing a layer of Si over the layer of Ru the Ru and Si being deposited sufficiently thick that they intermix to form an amorphous Ru-silicide; and
depositing a sensor stack over the layers of Ru and Si.
15. A method as in claim 14 wherein the depositing a sensor stack further comprises:
depositing a layer of antiferromagnetic material over the layer of Si;
depositing a pinned layer structure over the layer of antiferromagnetic material;
depositing a non-magnetic layer over the pinned layer structure; and
depositing a magnetic free layer over the non-magnetic layer.
16. A method as in claim 15 wherein the non-magnetic layer is deposited to a thickness of 17-30 Angstroms.
17. A method as in claim 14 wherein the layer of Ru and the layer of Si are each deposited to a thickness of 2-3 Angstroms.
18. A method for manufacturing a magnetoresistive sensor, comprising:
providing a substrate;
depositing a layer of Si over the substrate;
depositing a layer of Ru over the layer of Si the layers of Si and Ru being deposited sufficiently thin that they intermix to form an amorphous Ru-silicide; and
depositing a sensor stack over the layer of Ru and Si.
19. A method as in claim 18 wherein the layer of Si and the layer of Ru each have a thickness of 2 to 3 Angstroms.
20. A method for manufacturing a magnetoresistive sensor, comprising:
providing a substrate;
depositing Ru and Si over the substrate the Ru and Si being deposited sufficiently thin that they intermix to form an amorphous Ru-silicide;
depositing a layer of Ru over the Ru-silicide; and
depositing a sensor stack over the layer of Ru.
21. A method as in claim 20 wherein the layer of Ru deposited over the Ru-silicide has a thickness of 10-15 Angstroms.