Granted Patent B2

US 8,628,838 · App. 11/867,572 · Granted Jan 14, 2014

Abstract

Claims (43)

1. A product comprising:

a multilayer thermo-reversible dry adhesive comprising:

a first layer comprising a soft dry adhesive configured to contact and adhere to a counter surface of a substrate;

a second layer comprising a shape memory polymer constructed and arranged to change the shape of the thermo-reversible dry adhesive;

wherein the multilayer thermo-reversible dry adhesive forms a first shape to allow sufficient contact with the counter surface for adhesive bonding to the substrate at a first temperature after a preload is applied to the thermo-reversible dry adhesive, and said multi-layer thermo-reversible dry adhesive is constructed and arranged to cause and to produce a memorized second curved shape to reduced adhesion to said counter surface at a second temperature without a load applied.

2. A product as set forth in claim 1 wherein the shape memory polymer comprises a product of a reaction mixture comprising:

at least one of a rigid epoxy or a flexible epoxy; and

at least one of a crosslinking agent or a catalytic curing agent;

wherein the rigid epoxy is an aromatic epoxy having at least two epoxide groups, the flexible epoxy is an aliphatic epoxy having at least two epoxide groups, and the crosslinking agent is one of a multi-amine, an organic multi-carboxylic acid, or an anhydride.

3. A product as set forth in claim 1 wherein the soft dry adhesive comprises a product of a reaction mixture comprising:

at least one of a rigid epoxy or a flexible epoxy; and

at least one of a crosslinking agent or a catalytic curing agent;

wherein the rigid epoxy is an aromatic epoxy having at least two epoxide groups, the flexible epoxy is an aliphatic epoxy having at least two epoxide groups, and the crosslinking agent is one of a multi-amine, an organic multi-carboxylic acid, or an anhydride.

4. A product as set forth in claim 1 further comprising a substrate wherein the multilayer thermo-reversible dry adhesive is positioned on top of the substrate with the first layer in contact with the substrate.

5. A product as set forth in claim 4 wherein said first shape is a relatively flat structure, said second shape is a relatively curved structure and the pull-off force of the multilayer thermo-reversible dry adhesive from the substrate with the curved structure is about 0 to 50 N/cm 2 .

6. A product as set forth in claim 5 wherein the pull-off force of the multilayer thermo-reversible dry adhesive from the substrate with the relatively flat structure is about 10 to about 200 N/cm 2 .

7. A method comprising:

forming a multilayer thermo-reversible dry adhesive comprising:

forming a first layer by providing a shape memory polymer component mixture into a pan having a circular shape and curing the a shape memory polymer component mixture to form the first layer having a curved shape;

forming a second layer by disposing and curing a soft adhesive component mixture over the first layer;

wherein said first layer and second layer are joined together such that the multilayer thermo-reversible adhesive has a relatively flat structure at a first temperature and constructed and arranged to cause and to produce a memorized relatively curved structure at a second temperature without a load applied.

8. A method as set forth in claim 7 wherein the shape memory polymer component mixture comprises:

at least one of a rigid epoxy or a flexible epoxy; and

at least one of a crosslinking agent or a catalytic curing agent;

wherein the rigid epoxy is an aromatic epoxy having at least two epoxide groups, the flexible epoxy is an aliphatic epoxy having at least two epoxide groups, and the crosslinking agent is one of a multi-amine, an organic multi-carboxylic acid, or an anhydride.

9. A method as set forth in claim 7 wherein the shape memory polymer component mixture comprises an aromatic diepoxy, an aliphatic diepoxy, and a diamine.

10. A method as set forth in claim 9 wherein the aromatic diepoxy is diglycidyl ether of bisphenol A epoxy monomer with an approximate epoxy equivalent weight of 180.

11. A method as set forth in claim 9 wherein the aliphatic diepoxy is neopentyl glycol diglycidyl ether.

12. A method as set forth in claim 9 wherein the diamine is polypropylene glycol)bis(2-aminopropyl) ether with an average molecular weight of 230.

13. A method as set forth in claim 7 wherein the soft adhesive component mixture comprises an aliphatic diepoxy and a diamine, and wherein the diepoxy and the diamine are present in an amount sufficient to provide, upon curing of the second layer, a soft epoxy dry adhesive layer having a glass transition temperature of −90° C. to 200° C. and having a pull-off strength of 1-200 N/cm 2 .

14. A method comprising:

providing a multilayer thermo-reversible dry adhesive comprising at least one dry adhesive layer and at least one shape memory polymer layer;

heating the multilayer thermo-reversible dry adhesive to a temperature higher than the glass transition temperature of the shape memory polymer;

imposing a load on the multilayer thermo-reversible dry adhesive with the dry adhesive layer in contact with an underlying substrate while cooling to a temperature below the glass transition temperature of the shape memory polymer, so that the multilayer thermo-reversible dry adhesive forms a strong adhesive bond to the underlying substrate;

heating the multilayer thermo-reversible dry adhesive to a temperature above the glass transition temperature of the shape memory polymer without an applied load; and

wherein, upon heating, the multilayer thermo-reversible dry adhesive is constructed and arranged to cause and to produce a memorized shape to reduced adhesion to said underlying substrate.

15. A method as set forth in claim 14 wherein the load is about 1N/cm 2 to about 20 N/cm 2 .

16. A method as set forth in claim 14 wherein the glass transition temperature of the shape memory polymer is about 25 to about 200° C.

17. A method as set forth in claim 14 wherein the glass transition temperature of the dry adhesive is about −90 to about 200° C.

18. A method as set forth in claim 14 wherein the underlying substrate comprises one of stainless steel, glass, aluminum alloy 5657, polypropylene, or Teflon.

19. A product as set forth in claim 1 wherein said first shape allows said thermo-reversible dry adhesive to approach maximal contact with said counter surface at a preload of 4 N/cm 2 or greater, and said second shape causes substantially reduced contact with said counter surface.

20. A product as set forth in claim 1 , wherein said shape memory polymer has a glass transition temperature higher than said first temperature and lower than said second temperature.

21. A product as set forth in claim 3 wherein said soft dry adhesive layer comprises an epoxy resin prepared from a mixture comprising an aliphatic diepoxy and a diamine, and the epoxy resin has a glass transition temperature between about −90° C. and 25° C.

Assignments (12)