Method of fabrication for read head having shaped read sensor-biasing layer junctions using partial milling
View Patent ↗A method is disclosed for fabricating a read head for a magnetic disk drive having a read head sensor and a hard bias layer, where the read head has a shaped junction between the read head sensor and the hard bias layer. The method includes providing a layered wafer stack to be shaped. A single- or multi-layered photoresist mask having no undercut is deposited upon the layered wafer stack to be shaped. The layered wafer stack is shaped by the output of a milling source, where the shaping includes partial milling to within a partial milling range to form a shaped junction. A hard bias layer is then deposited which is in contact with the shaped junction of the wafer stack.
1. A method for fabricating a read head for a hard disk drive having a read head sensor and a hard bias layer, said read head having a shaped junction between said read head sensor and said hard bias layer, said method comprising:
A) providing a layered wafer stack to be shaped, said layered wafer stack including a free layer, an AFM layer and a first seed layer;
B) depositing a single- or multi-layered photoresist mask having no undercut upon said layered wafer stack to be shaped;
C) providing a milling source which produces an output at a defined angle of projection;
D) adjusting the angle of said layered wafer stack to be shaped relative to said angle of projection of said milling source;
E) establishing a partial milling range by which milling extends at least through said free magnetic layer, but stops short of milling completely through said first seed layer;
F) partially milling said layered wafer stack by said output of said milling source to within said partial milling range where said partial milling extends to a partial milling depth having a depth endpoint within said partial milling range, where said depth endpoint of said partial milling lies within said first seed layer to form the shaped junction: and
G) depositing said hard bias layer in contact with said shaped junction.
2. The method of shaping of claim 1 , wherein:
the milling source is ion milling or reactive ion beam etching.
3. The method of shaping of claim 1 , wherein:
said milling source is angled relative to said layer structure to be shaped.
4. The method of shaping of claim 1 , wherein:
said layer structure to be shaped is angled relative to said milling source.
5. The method of fabrication of claim 1 , wherein:
D) includes adjusting said angle at high incidence.
6. The method of fabrication of claim 5 , wherein:
D) includes adjusting said angle at razing incidence.
7. The method of fabrication of claim 6 , wherein:
F) includes multiple cycles of milling at both high incidence and razing incidence.
8. A method for fabricating a read head for a hard disk drive having a read head sensor and a hard bias layer, said read head having a shaped junction between said read head sensor and said hard bias layer, said method comprising:
A) providing a layered wafer stack to be shaped, said layered wafer stack including a free layer, an AFM layer and a first seed layer;
B) depositing a single- or multi-layered photoresist mask having no undercut upon said layered wafer stack to be shaped;
C) providing a milling source which produces an output at a defined angle of projection;
D) adjusting the angle of said layered wafer stack to be shaped relative to said angle of projection of said milling source at high incidence and razing incidence;
E) establishing a partial milling range by which milling extends at least through said free magnetic layer, but stops short of milling completely through said first seed layer;
F) partially milling said layered wafer stack by said output of said milling source to within said partial milling range where said partial milling extends to a partial milling depth having a depth endpoint within said partial milling range, to form the shaped junction: and
G) depositing said hard bias layer in contact with said shaped junction.
9. A method for fabricating a read head for a hard disk drive having a read head sensor and a hard bias layer, said read head having a shaped junction between said read head sensor and said hard bias layer, said method comprising:
A) providing a layered wafer stack to be shaped, said layered wafer stack including a free layer, an AFM layer and a first seed layer;
B) depositing a single- or multi-layered photoresist mask having no undercut upon said layered wafer stack to be shaped;
C) providing a milling source which produces an output at a defined angle of projection;
D) adjusting the angle of said layered wafer stack to be shaped relative to said angle of projection of said milling source;
E) establishing a partial milling range by which milling extends at least through said free magnetic layer, but stops short of milling completely through said first seed layer;
F) partially milling said layered wafer stack by said output of said milling source to within said partial milling range where said partial milling extends to a partial milling depth having a depth endpoint within said partial milling range, to form the shaped junction, including multiple cycles of milling at both high incidence and razing incidence; and
G) depositing said hard bias layer in contact with said shaped junction.