Connection of wire to a lead frame
An integrated circuit includes a first lead frame and a second lead frame that extend from an overmolded circuit assembly. Each of the lead frames includes a piercing portion to pierce through insulation on a corresponding electrical conduit. The piercing portion of the lead frames also provides a wrap around feature to mechanically secure the wire to the corresponding electrical conduit. In this manner, several processes can be eliminated and are not required for the desired mechanical and electrical connection of the integrated circuit lead frame to corresponding electrical conductors.
1. An integrated circuit assembly comprising:
a circuit overmolded to protect elements of the circuit;
a first lead extending from the circuit including a first pointed end; and
a second lead extending from the circuit including a second pointed end, wherein the first pointed end and the second pointed end include a length determined to extend through a corresponding pierced wire, wherein said length wraps at least partially around the corresponding pierced wire.
2. A method of attaching a wire to a lead frame comprising the steps of:
forming a piercing end on a first end of a lead frame;
piercing a wire with the piercing end to provide an electrically conductive connection between the wire and the lead frame;
extending the first end completely through the pierced wire; and
wrapping the first end at least partially about an outer surface of the pierced wire for securing the pierced wire to the lead frame.
3. The method as recited in claim 2 , including the step of bending the piercing portion relative to other portions of the lead frame.
4. The method as recited in claim 2 , wherein the piercing portion is disposed on a clip separate from the lead frame.
5. The method as recited in claim 4 , including legs attached to the piercing portion and the step of wrapping the legs about the wire and the lead frame.
6. The method as recited in claim 5 , including the step of forming the piercing portion and legs from a piece of sheet metal.
7. The method as recited in claim 2 , including cutting material from the lead frame to form a pointed tip on the piercing end.
8. The method as recited in claim 2 , including piercing a face of the wire with the piercing end where the face of the wire us perpendicular to a length of the wire.
9. The method as recited in claim 2 , including piercing a longitudinal surface of the wire with the piercing end.
10. A lead frame for an integrated circuit comprising:
a first lead including a first pointed end for piercing a face of a first electrical conduit; and
a second lead including a second pointed end for piercing a face of second electrical conduit, wherein the faces of the first and second electrical conduits comprises a terminal end surface of each of the first and second electrical conduits.
11. The lead frame as recited in claim 10 , wherein the first lead and the second lead comprises a rectangular metal strip.
12. The lead frame as recited in claim 10 , wherein the first pointed end and the second pointed end comprise one angled side on each of the first lead and the second lead.
13. The lead frame as recited in claim 11 , where the angled sides of the first and second leads are disposed on a side opposite the other of the first and second lead.
14. The lead frame as recited in claim 12 , including serrations on each of the angled sides of the first and second leads.
15. An integrated circuit assembly comprising:
a circuit overmolded to protect elements of the circuit;
a first lead extending from the circuit including a first pointed end comprising an angular side extending across a width of the first lead; and
a second lead extending from the circuit including a second pointed end comprising an angular side extending across a width of the second lead.
16. The assembly as recited in claim 15 , wherein each of the angular sides include serrations.
17. The assembly as recited in claim 15 , wherein the first pointed end and the second pointed end include a length that extends through a pierced wire that is wrapped about an outer surface of the pierced wire for holding the pierced wire to the corresponding lead.
18. An integrated circuit assembly comprising:
a circuit disposed within an overmolding material;
a first lead extending from the circuit within the overmolded material, the first lead including a first crimp pad formable to form an electrical connection to an electrical conduit; and
a second lead extending from circuit within the overmolded material, the second lead including a second crimp pad formable to from an electrical connection to an electrical conduit, the second crimp pad spaced a distance from the circuit different than a distance of the first crimp pad from the circuit.
19. The assembly as recited in claim 18 , wherein each of the first crimp pad and the second crimp pad comprise a width greater than the corresponding first lead and the second lead.