Lead frame mount for circuit component
View Patent ↗An integrated circuit includes a positive lead defining a first pocket and a negative lead spaced apart from the positive lead that defines a second pocket that is aligned with the first pocket. The first and second pockets are adapted to receive and hold an electrical device such as a capacitor therein.
1. An integrated circuit device comprising:
an integrated circuit;
a positive lead extending from the integrated circuit and including a first pocket; and
a negative lead extending from the integrated circuit and spaced apart from the positive lead, and including a second pocket aligned with the first pocket, wherein said first pocket and said second pocket receive and hold an electrical device electrically connected in parallel with the integrated circuit.
2. The integrated circuit device as recited in claim 1 , wherein the electrical device comprises a capacitor.
3. The integrated circuit device as recited in claim 1 , wherein the electrical device extends from the first pocket on the positive lead into the second pocket on the negative lead.
4. The integrated circuit device as recited in claim 1 , wherein the first pocket and the second pocket comprise fingers extending transverse to each of said positive and negative leads that define a space between the positive lead and the negative lead for the electrical device.
5. The integrated circuit device as recited in claim 4 , wherein each of the fingers include a curved portion that curves inwardly toward each other.
6. The integrated circuit device as recited in claim 5 , wherein the curved portion of each of the fingers is spaced apart from the corresponding positive and negative leads.
7. The integrated circuit device as recited in claim 1 , wherein the first pocket and the second pocket comprise a bend in each of the corresponding positive and negative leads.
8. The integrated circuit device as recited in claim 7 , wherein the bend includes opposing sides spaced longitudinally from each other to define a space therebetween for the electrical device.
9. The integrated circuit device as recited in claim 8 , wherein the opposing sides are spaced a distance apart determined to provide an electrically conductive fit with the electrical device.
10. The integrated circuit device as recited in claim 1 , wherein the first pocket and the second pocket are encapsulated with the electric device disposed therein.
11. The integrated circuit device as recited in claim 1 , wherein each of the positive and negative leads comprise a substantially rectangular conductive member including a width greater than a thickness.
12. The integrated circuit device as recited in claim 1 , wherein the integrated circuit comprises a Hall effect sensor.
13. A method of mounting an electrical component across leads of an integrated circuit comprising the steps of:
a) defining a first pocket in a first lead extending from an integrated circuit by selective bending a portion of the first lead;
b) defining a second pocket in a second lead extending from the integrated circuit by selective bending a portion of the second lead; and
c) receiving and holding an electrical component in parallel with the integrated circuit within the first pocket and the second pocket.
14. The method as recited in claim 13 , including the step of aligning the first pocket with the second pocket.
15. The method as recited in claim 13 , including the step of cutting a finger from each of the first lead and the second lead and bending each the finger to extend transverse to the widest surface of each of the first lead and the second leads.
16. The method as recited in claim 15 , including the step of forming a bend portion in each of the fingers transverse to the widest surface of each of the first and second leads.
17. The method as recited in claim 13 , wherein the steps of selective bending a portion of the first lead and the second lead includes forming a U-shape within each of the first and second leads.
18. The method as recited in claim 17 , wherein the U-shape within each of the first and second leads includes a first side and second side spaced apart from each other a desired distance.
19. The method as recited in claim 18 , wherein the desired distance provides an electrically conductive interface with the electrical component.
20. The method as recited in claim 13 , including the step of encapsulating the electrical component and a portion of the first lead and the second lead.
21. The method as recited in claim 13 , wherein the integrated circuit comprises a Hall effect sensor.