Integrated circuit package system with interconnect lock

1. A method for manufacturing an integrated circuit package system comprising:

mounting an integrated circuit die over a package carrier;

mounting a device structure over the integrated circuit die;

connecting an internal interconnect between the device structure and the package carrier;

forming an interconnect lock only over a portion of the internal interconnect over a periphery of the device structure with the interconnect lock exposing the device structure; and

forming a package encapsulation surrounding the interconnect lock and over the package carrier.

2. The method as claimed in claim 1 wherein mounting the device structure includes mounting an interposer.

3. The method as claimed in claim 1 wherein mounting the device structure includes mounting the device structure over the integrated circuit device with an adhesive in between.

4. The method as claimed in claim 1 further comprising:

forming an inner encapsulation over the integrated circuit die; and

wherein mounting the device structure over the integrated circuit die includes:

mounting the device structure over the inner encapsulation.

5. The method as claimed in claim 1 further comprising mounting a component over the device structure without the package encapsulation.

6. A method for manufacturing an integrated circuit package system comprising:

mounting an integrated circuit die over a package carrier;

mounting a device structure over the integrated circuit die;

connecting a bond wire between the device structure and the package carrier;

forming an interconnect lock only over a portion of the internal interconnect over a periphery of the device structure with the interconnect lock exposing the device structure;

forming a package encapsulation surrounding the interconnect lock and over the package carrier; and

mounting a component over the device structure without the package encapsulation.

7. The method as claimed in claim 6 wherein forming the interconnect lock includes forming the interconnect lock in a configuration of a dam structure.

8. The method as claimed in claim 6 wherein forming the package encapsulation includes exposing the device structure.

9. The method as claimed in claim 6 wherein forming the interconnect lock on the bond wire includes depositing the interconnect lock not contoured to the bond wire.

10. The method as claimed in claim 6 further comprising attaching an external interconnect to and below the package carrier.

11. An integrated circuit package system comprising:

a package carrier;

an integrated circuit die over the package carrier;

a device structure over the integrated circuit;

an interconnect lock only over a portion of the internal interconnect over a periphery of the device structure with the interconnect lock exposing the device structure; and

an interconnect lock over the internal interconnect over the device structure with the interconnect lock exposing the device structure; and

a package encapsulation surrounding the interconnect lock and over the package carrier.

12. The system as claimed in claim 11 wherein the device structure includes an interposer.

13. The system as claimed in claim 11 further comprising an adhesive between the device structure and the integrated circuit device.

14. The system as claimed in claim 11 further comprising:

an inner encapsulation over the integrated circuit die; and wherein the device structure over the package carrier includes:

the device structure over the inner encapsulation.

15. The system as claimed in claim 11 further comprising a component over the device structure.

16. The system as claimed in claim 11 further comprising:

an integrated circuit die over the package carrier;

a component over the device structure; and

wherein:

the device structure over the package carrier includes:

the device structure over the integrated circuit die; and

the internal interconnect includes:

a bond wire.

17. The system as claimed in claim 16 wherein the interconnect lock includes a dam structure.

18. The system as claimed in claim 16 wherein the package encapsulation exposes the device structure.

19. The system as claimed in claim 16 wherein the interconnect lock over the bond wire includes the interconnect lock not contoured to the bond wire.

20. The system as claimed in claim 16 further comprising an external interconnect attached to and below the package carrier.