Method of making multi-chip package with high-speed serial communications between semiconductor dice
View Patent ↗A multi-chip package includes a package substrate. First and second semiconductor die are formed on the package substrate. The first and the second semiconductor die are configured to communicate with each other via a high-speed serial communications protocol.
1. A method of making a multi-chip package configured to provide high-speed serial communications between semiconductor dice forming a portion thereof, comprising:
providing a package substrate;
forming a first semiconductor die comprising a first processor having a first set of speed and performance criteria associated therewith, the first semiconductor die further comprising first electronic circuitry in addition to the first processor;
forming a second semiconductor die comprising a second processor having a second set of performance and speed criteria associated therewith, the first set of criteria being different from the second set of criteria, the second semiconductor die further comprising second electronic circuitry in addition to the second processor;
attaching the first and second dice to the package substrate; and
operatively coupling the first and the second semiconductor dice together using three or less communication links disposed on or within the multi-chip package such that the first and second dice are configured to communicate with one another by means of a high-speed serial communications protocol, the first processor and first electronic circuitry being optimized for performance in respect of the first set of criteria, the second processor and second electronic circuitry being optimized for performance in respect of the second set of criteria, wherein all communications between the first and the second semiconductor dice occur over the three or less communication links.
2. The method of claim 1 , further comprising providing the high-speed communications protocol and the three or less communication links in such a configuration as to provide a communications rate between the first and second dice of at least one gigabit per second (Gbps).
3. The method of claim 1 , further comprising providing the high-speed communications protocol and the three or less communication links in such a configuration as to provide a communications rate between the first and second dice of at least ten gigabits per second (Gbps).
4. The method of claim 1 , further comprising providing the first semiconductor die such that the first die comprises at least one of a memory, phase-locked loop circuitry, input/output circuitry, and logic circuitry.
5. The method of claim 1 , further comprising providing the second semiconductor die such that the second die comprises at least one of a memory, phase-locked loon circuitry, input/output circuitry, and logic circuitry.
6. The method of claim 1 , further comprising providing a plurality of interconnection structures for connecting the first and second semiconductor dice to one another.
7. The method of claim 1 , wherein the multi-chip package is configured in at least one of a stacked die configuration and a flip-chip configuration.