Charge plate fabrication technique
A charge plate and a method for fabricating a charge plate for an ink jet printhead includes the steps of removing portions of conductive material from a dimensionally stable substrate with a coating of conductive material to form at least a first and second electrode on a first face with a first space between the first and second electrodes, removing portions of conductive material from the dimensionally stable substrate with a coating of conductive material to form a first electrode extension which engages the first electrode on the conductive charging face, and a second electrode extension which engages the second electrode on the conductive charging face, whereby the first and second electrode extensions are electrically isolated from each other, additionally forming a first space between the electrode extensions, which connects with the first space between the electrode extensions.
1. A method for fabricating a charge plate for an ink jet printhead, wherein the method comprises the steps of:
providing a dimensionally stable dielectric substrate, the dimensionally stable dielectric substrate including a coating of conductive material on a first conductive face, a charging face, a third face, and a first edge located between the first conductive face and the charging face;
removing portions of the conductive material coating from the dimensionally stable dielectric substrate using ablation to form at least a first electrode and a second electrode on the first conductive face with a first space between the first electrode and second electrode;
removing portions of the conductive material coating from the dimensionally stable dielectric substrate to form a first electrode extension on the charging face which engages the first electrode and form a second electrode extension on the charging face which engages the second electrode, the first and second electrode extensions being electrically isolated from each other;
forming a first third face electrode and a second third face electrode on the third face with a fourth space between the first third face electrode and the second third face electrode on the dimensionally stable dielectric substrate and forming a third edge between the third face and the charging face by removing a portion of the conductive material coating deposited on the third face forming a fourth space, and wherein a non patterned conductive region is formed between the fourth space and the third edge;
forming on the charging face a first third face electrode extension which engages the first third face electrode and a second third face electrode extension which engages the second third face electrode by removing a portion of the continuous conductive coating deposited on the charging face to form a fifth space on the charging face between the at least two third face electrode extensions, and wherein the first third face electrode extension is electrically isolated from the second third face electrode extension; and
removing a portion of the first third face electrode and the second third face electrode to extend the fourth space to form a continuous connected space with fifth space on the charging face.
2. The method of claim 1 , further comprising the step of forming at least one additional space as at least one additional electrode is formed on both faces.
3. The method of claim 1 , further comprising the step of coating the first face of the charge plate with a protective dielectric material.
4. The method of claim 3 , wherein the protective dielectric material is a member of one of: an epoxy, a polyimide, a thick film, a thin film and combinations thereof.
5. The method of claim 3 , wherein the protective dielectric material can be deposited by screen printing, vapor deposition, chemical deposition, sputtering, or combinations thereof.
6. The method of claim 1 wherein the steps for removing the portions of the conductive material coating of the first conductive face and the charging face are simultaneously performed.
7. The method of claim 1 , wherein the step for removing portions of the conductive material coating from the dimensionally stable dielectric substrate is performed by laser ablation.
8. The method of claim 1 , further comprising using a dimensionally stable dielectric substrate which has a length that is slightly longer than the length of a jet array for the ink jet printhead.
9. The method of claim 1 , wherein the ink jet printhead is for a continuous ink jet printhead.
10. The method of claim 1 , wherein the dimensionally stable dielectric substrate with the coating of conductive material has a thin rectangular shape.
11. The method of claim 1 , wherein the dimensionally stable dielectric substrate with the coating of conductive material has a width between 1 inch and 6 inches, a length between ¼ inches and 30 inches, and a thickness between 0.004 inch and 0.4 inch.
12. The method of claim 1 , wherein the dimensionally stable dielectric substrate with the coating of conductive material comprises a coating with at least a second conductive coating deposited over a first conductive coating.
13. The method of claim 1 , wherein the dimensionally stable dielectric substrate with the coating of conductive material is a ceramic, glass, quartz, or composites thereof.
14. The method of claim 1 , wherein the dimensionally stable dielectric substrate with the coating of conductive material comprises a coating with a thickness between 1,000 Angstroms and 10,000 Angstroms.
15. The method of claim 1 , wherein the dimensionally stable dielectric substrate with the coating of conductive material comprises a coating of titanium, gold, platinum, palladium, silver, nickel, tantalum, tungsten alloys, or combinations thereof.
16. The method of claim 1 , wherein the first edge is beveled.
17. The method of claim 16 , wherein the first edge has a radius of less than 50 microns.