IP Library Granted Patent US 8,787,772
Granted Patent B2
US 8,787,772 · App. 12/030,499 · Granted Jul 22, 2014

Laser package including semiconductor laser and memory device for storing laser parameters

Inventor: Chan Chih Chen (Macungie, PA)
Assignee: Applied Optoelectronics, Inc.
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Quick Facts
Patent No.
US 8,787,772
App. No.
12/030,499
Granted
Jul 22, 2014
Kind
B2
Abstract

A laser package may include a semiconductor laser and a memory device integrated into the laser package for storing parameters associated with the laser. The parameters may include laser manufacturing, operational and/or user parameters. For example, the semiconductor laser may be tunable and the memory device may store tuning parameter data. One example of the laser package is a tunable transmitter optical sub-assembly (TOSA) package.

Claims (31)

1. A transmitter optical sub-assembly (TOSA) laser package comprising:

a laser package support structure including a TOSA housing defining a laser package region;

a semiconductor laser supported by the laser package support structure and enclosed within the TOSA housing, the semiconductor laser being configured to generate light output in response to electrical input;

a memory device supported by the laser package support structure and enclosed within the TOSA housing such that the memory device is inside the TOSA package, the memory device being configured to store parameter data representing parameters associated with the semiconductor laser; and

conductive paths extending from the laser package support structure to the exterior of the TOSA package, the conductive paths including at least one laser input path configured to receive the electrical input to the laser and at least one memory data path configured to carry the parameter data.

2. The laser package of claim 1 wherein the semiconductor laser is tunable, and wherein the conductive paths include wavelength tuning control paths.

3. The laser package of claim 1 wherein the laser package support structure includes an optical fiber coupling portion configured to couple to an optical fiber to the laser package such that the light output of the semiconductor is coupled into the optical fiber.

4. The laser package of claim 1 further comprising leads coupled to the conductive paths and extending from the laser package support structure.

5. The laser package of claim 1 wherein the laser package support structure includes at least one laser package sub-mount, and wherein the semiconductor laser and the memory device are mounted on the at least one laser package sub-mount.

6. The laser package of claim 1 wherein the memory device is an integrated circuit memory device.

7. The laser package of claim 1 wherein the memory device is configured for serial data communication.

8. The laser package of claim 1 wherein the memory device is configured for serial data communication using two lines including a serial data (SDA) line and a serial clock (SCL) line.

9. The laser package of claim 1 wherein the memory device is configured for serial data communication using an I 2 C protocol.

10. The laser package of claim 1 wherein the laser package is an integrated circuit including both the semiconductor laser and the memory device.

11. The laser package of claim 1 wherein the memory device includes at least operational parameter data stored thereon.

12. The laser package of claim 11 wherein the semiconductor laser is tunable, and wherein the operational parameter data represents tuning parameters associated with the semiconductor laser.

13. The laser package of claim 11 wherein the operational parameter data represents at least one operational parameter selected from the group consisting of an output light intensity as a function of a drive current, a slope efficiency as a function of a drive current, a threshold current as a function of temperature, a wavelength as a function of a drive current, and a wavelength as a function of temperature.

14. The laser package of claim 1 wherein said memory device includes at least manufacturing parameter data stored thereon.

15. The laser package of claim 14 wherein the manufacturing parameter data represents at least one manufacturing parameter selected from the group consisting of emission wavelength, part number, lot number, date of manufacture, and operating temperature range.

16. The laser package of claim 1 wherein the memory device is configured to store at least user parameter data.

17. The laser package of claim 16 wherein the user parameter data represents at least one user parameter selected from the group consisting of an output light intensity as a function of a drive current, a slope efficiency as a function of a drive current, a threshold current as a function of temperature, a wavelength as a function of a drive current, and a wavelength as a function of temperature.

18. A laser transmitter comprising:

a transmitter optical sub-assembly (TOSA) laser package comprising:

a laser package support structure including a TOSA housing defining a laser package region;

a semiconductor laser supported by the laser package support structure and enclosed within the TOSA housing, the semiconductor laser being configured to generate light output in response to electrical input;

a memory device supported by the laser package support structure and enclosed within the TOSA housing such that the memory device is inside the TOSA package, the memory device being configured to store parameter data representing parameters associated with the semiconductor laser; and

conductive paths extending from the laser package support structure, the conductive paths including at least one laser input path configured to receive the electrical input to the laser and at least one memory data path configured to carry the parameter data representing; and

laser drive circuitry coupled to the semiconductor laser and configured to provide the electrical input to the semiconductor laser, wherein the laser drive circuitry is located outside of the TOSA housing.

19. The laser transmitter of claim 18 wherein the laser drive circuitry is configured to communicate with at least the memory device to receive the parameter data from the memory device.

20. The laser transmitter of claim 18 wherein the semiconductor laser is tunable.

21. The laser transmitter of claim 19 wherein the memory device is configured to store operational parameter data representing tuning parameters associated with the semiconductor laser.

Assignments (10)
SECURITY INTEREST Recorded Aug 1, 2025
From: APPLIED OPTOELECTRONICS, INC.
To: BOKF, NA D/B/A BOK FINANCIAL
Reel/Frame 072338/0695 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Nov 20, 2023
From: CIT NORTHBRIDGE CREDIT LLC
To: APPLIED OPTOELECTRONICS, INC.
Reel/Frame 065630/0906 →
PATENT SECURITY AGREEMENT Recorded Nov 28, 2022
From: APPLIED OPTOELECTRONICS, INC.
To: CIT NORTHBRIDGE CREDIT LLC
Reel/Frame 062003/0523 →
RELEASE OF SECURITY INTEREST Recorded Nov 16, 2022
From: TRUIST BANK (FORMERLY KNOWN AS BRANCH BANKING AND TRUST COMPANY))
To: APPLIED OPTOELECTRONICS, INC.
Reel/Frame 061952/0344 →
RELEASE OF SECURITY INTEREST Recorded Oct 5, 2017
From: EAST WEST BANK, SUCCESSOR IN INTEREST TO UNITED COMMERCIAL BANK
To: APPLIED OPTOELECTRONICS INC
Reel/Frame 043800/0480 →
RELEASE OF SECURITY INTEREST Recorded Oct 5, 2017
From: EAST WEST BANK
To: APPLIED OPTOELECTRONICS INC
Reel/Frame 044207/0573 →
SECURITY INTEREST Recorded Sep 29, 2017
From: APPLIED OPTOELECTRONICS, INC.
To: BRANCH BANKING AND TRUST COMPANY
Reel/Frame 044061/0812 →
SECURITY INTEREST Recorded Jul 2, 2015
From: APPLIED OPTOELECTRONICS, INC.
To: EAST WEST BANK
Reel/Frame 036047/0293 →
SECURITY AGREEMENT Recorded May 4, 2010
From: APPLIED OPTOELECTRONICS, INC.
To: EAST WEST BANK, SUCCESSOR IN INTEREST TO UNITED COMMERCIAL BANK
Reel/Frame 024332/0828 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 13, 2008
From: CHEN, CHAN CHIH
To: APPLIED OPTOELECTRONICS, INC.
Reel/Frame 020503/0890 →
Continuity (1)
Related Publication 20090202256A1 · Aug 13, 2009