Inductively coupled integrated circuit with magnetic communication path and methods for use therewith
An integrated circuit includes a first integrated circuit die having a first circuit and a first inductive interface and a second integrated circuit die having a second circuit and a second inductive interface. A substrate is coupled to support the first integrated circuit die and the second integrated circuit die, the substrate including a magnetic communication path aligned with the first inductive interface and the second inductive interface, to magnetically communicate signals between the first circuit and the second circuit.
1. An integrated circuit comprising:
a first integrated circuit die having a first circuit and a first inductive interface that includes a first coil; and
a second integrated circuit die having a second circuit and a second inductive interface that includes a second coil;
a substrate coupled to support the first integrated circuit die and the second integrated circuit die, the substrate including a magnetic communication path aligned with the first inductive interface and the second inductive interface, to magnetically communicate signals between the first circuit and the second circuit;
wherein the magnetic communication path includes a third coil aligned with the first coil and a fourth coil, coupled to the third coil and aligned with the second coil.
2. The integrated circuit of claim 1 wherein the first integrated circuit die is bonded to the substrate via a ferromagnetic glue.
3. The integrated circuit of claim 2 wherein the second integrated circuit die is bonded to the substrate via a ferromagnetic glue.
4. The integrated circuit of claim 1 wherein the third coil is planarly aligned with the first coil and the fourth coil is planarly aligned with the second coil.
5. The integrated circuit of claim 1 wherein the third coil is axially aligned with the first coil and the fourth coil is axially aligned with the second coil.
6. The integrated circuit of claim 1 wherein the magnetic communication path includes a ferromagnetic material.
7. The integrated circuit of claim 1 wherein the magnetic communication path is aligned to magnetically communicate signals bidirectionally between the first circuit and the second circuit.
8. The integrated circuit of claim 1 wherein the first integrated circuit die is stacked above the substrate and the second integrated circuit die is stacked below the substrate in a flip-chip configuration.
9. An integrated circuit comprising:
a first integrated circuit die having a first circuit and a first inductive interface; and
a second integrated circuit die having a second circuit and a second inductive interface;
a substrate coupled to support the first integrated circuit die and the second integrated circuit die, the substrate including a magnetic communication path aligned with the first inductive interface and the second inductive interface, to magnetically communicate signals between the first circuit and the second circuit;
wherein the magnetic communication path is aligned to magnetically communicate signals bidirectionally between the first circuit and the second circuit.
10. The integrated circuit of claim 9 wherein the first integrated circuit die is bonded to the substrate via a ferromagnetic glue.
11. The integrated circuit of claim 10 wherein the second integrated circuit die is bonded to the substrate via a ferromagnetic glue.
12. The integrated circuit of claim 9 wherein the first inductive interface includes a first coil and the second inductive interface includes a second coil.
13. The integrated circuit of claim 12 wherein the magnetic communication path includes a third coil aligned with the first coil and a fourth coil, coupled to the third coil and aligned with the second coil.
14. The integrated circuit of claim 13 wherein the third coil is planarly aligned with the first coil and the fourth coil is planarly aligned with the second coil.
15. The integrated circuit of claim 13 wherein the third coil is axially aligned with the first coil and the fourth coil is axially aligned with the second coil.
16. The integrated circuit of claim 9 wherein the magnetic communication path includes a ferromagnetic material.
17. The integrated circuit of claim 9 wherein the first integrated circuit die is stacked above the substrate and the second integrated circuit die is stacked below the substrate in a flip-chip configuration.