Cycling LED heat spreader
View Patent ↗A graphite heat spreader is provided for use with a flash LED light source for a camera of a handheld device such as a cell phone. Dramatically reduced operating temperatures are provided at substantially increased power levels thus providing both improved lighting and improved operating life of the electronic components.
1. An electronic device, comprising:
a light source assembly including:
a substrate including an electrical circuit, the substrate having first and second major surfaces;
a light emitting diode located adjacent a first major surface of the substrate and connected to the electrical circuit; and
a heat spreader including a sheet of graphite, the heat spreader being in heat conducting association with the light emitting diode,
wherein the light emitting diode can be cycled on and off for at least two cycles which occur with a time period of no more than 10 seconds without an appreciable rise in the maximum temperature of the light emitting diode from cycle to cycle.
2. The device of claim 1 , wherein the sheet of graphite is selected from the group consisting of a sheet of compressed particles of exfoliated graphite and a graphitized polymer film.
3. The device of claim 2 , wherein the sheet of compressed particles of exfoliated graphite has a thickness in a range of from about 0.1 to about 1.5 mm.
4. The device of claim 1 , wherein the substrate is a flexible substrate.
5. The device of claim 1 , further comprising:
a thermal via extending through the substrate into thermal engagement with the heat spreader, the LED being mounted upon the thermal via.
6. The device of claim 1 , wherein:
the sheet of graphite has an in plane thermal conductivity of at least about 220 W/mK.
7. The device of claim 1 , wherein the substrate comprises a dielectric layer formed of a polymer material.
8. The device of claim 1 , wherein the heat spreader is in heat conducting association with the first major surface of the substrate.
9. The device of claim 1 , wherein the heat spreader is in heat conducting association with the second major surface of the substrate.