Flexible circuit board, motor equipped with the flexible circuit board, and hard disc drive apparatus
By providing a flexible circuit board of a laminated structure capable of preventing contamination such as fluff, miniscule pieces of iron, or textile scraps from becoming affixed to an outer peripheral cross-sectional surface of the flexible circuit board. It is possible to prevent contamination from becoming affixed to an outer peripheral cross-sectional surface of a flexible circuit board by setting a pressure-sensitive layer in such a manner that the pressure-sensitive layer does not protrude into the outer periphery of the flexible circuit board while affixing the flexible circuit board comprising of an insulating base film layer having a pressure-sensitive layer, a circuit conduction layer, and a cover film layer to a structure.
1 . A flexible circuit board affixed to a structure via a pressure-sensitive layer, the flexible circuit board comprising:
an insulating base film layer having a first surface on a side affixed to the structure and a second surface on an opposite side;
a circuit conduction layer laminated at the second surface at the base film layer; and
the pressure-sensitive layer provided at the first surface at the base film layer, arranged further to the inside than an outer peripheral end of the base film layer when viewed in a plane.
2 . The flexible circuit board according to claim 1 ,
wherein the pressure-sensitive layer has a positioning section formed at part of the outer peripheral end so as to align with an end surface of the outer peripheral end of the base film layer.
3 . The flexible circuit board according to claim 1 , wherein a distance between the outer peripheral end of the base film layer and the outer peripheral end of the pressure-sensitive layer is 0.185 mm to 0.4 mm.
4 . A motor equipped with the flexible circuit board according to claim 1 .
5 . The hard disc drive apparatus equipped with the motor according to claim 4 .
6 . A flexible circuit board comprising:
an insulating base film layer having a pressure-sensitive layer at a lower surface;
a circuit conduction layer laminated via an adhesive layer at an upper surface of the base film layer; and
an insulating cover film layer that covers an upper surface of a predetermined region of the circuit conduction layer via an adhesive layer and is laminated at the upper surface of the base film layer;
wherein the flexible circuit board is affixed to the structure using the pressure-sensitive layer of the base film layer, and
the outer peripheral end of the pressure-sensitive layer is made smaller than the outer peripheral end of the base film layer.