Method of manufacturing a nonvolatile semiconductor memory device, and a nonvolatile semiconductor memory device
For enhancing the high performance of a non-volatile semiconductor memory device having an MONOS type transistor, a non-volatile semiconductor memory device is provided with MONOS type transistors having improved performance in which the memory cell of an MONOS non-volatile memory comprises a control transistor and a memory transistor. A control gate of the control transistor comprises an n-type polycrystal silicon film and is formed over a gate insulative film comprising a silicon oxide film. A memory gate of the memory transistor comprises an n-type polycrystal silicon film and is disposed on one of the side walls of the control gate. The memory gate comprises a doped polycrystal silicon film with a sheet resistance lower than that of the control gate comprising a polycrystal silicon film formed by ion implantation of impurities to the undoped silicon film.
1. A semiconductor device comprising:
a first MISFET including:
a first gate insulative film formed over a first region of a semiconductor substrate; and
a first gate electrode formed over the first insulative film;
a second MISFET including:
a second gate insulative film formed over a second region of the semiconductor substrate; and
a second gate electrode formed over the second insulative film; and
a non-volatile memory cell including:
a third gate insulative film formed over a third region of the semiconductor substrate;
a control gate electrode formed over the third insulative film;
a fourth gate insulative film having a charge accumulation layer and formed over the third region and one side wall of the control gate electrode; and
a memory gate electrode formed over the fourth insulative film;
wherein the thickness of the first gate insulative film is smaller than that of the second gate insulative film, and
wherein the first and third insulative films have a same thickness.
2. A semiconductor device according to claim 1 , wherein the first gate electrode and the control gate electrode are formed of the same layer.
3. A semiconductor device according to claim 1 , wherein the first gate electrode, the second gate electrode and the control gate electrode are formed of the same layer.
4. A semiconductor device according to claim 1 , wherein the first gate electrode and the control gate electrode are formed of a silicon film doped with n-type impurities, respectively.
5. A semiconductor device according to claim 1 , wherein a writing operation of the non-volatile memory cell is performed by injecting hot electrons into the charge accumulation layer.
6. A semiconductor device according to claim 1 , wherein an erasing operation of the non-volatile memory cell is performed by injecting hot holes into the charge accumulation layer.
7. A semiconductor device according to claim 1 , wherein silicide layers are formed on the control gate electrode and the memory gate electrode.
8. A semiconductor device according to claim 7 , wherein the silicide layers are formed of cobalt silicide layers.
9. A semiconductor device according to claim 1 , wherein, in a gate length direction, the length of the memory gate electrode is smaller than that of the control gate electrode.
10. A semiconductor device according to claim 1 , wherein the charge accumulation layer is formed of a silicon nitride film.
11. A semiconductor device comprising:
a first MISFET including:
a first gate insulative film formed over a first region of a semiconductor substrate; and
a first gate electrode formed over the first insulative film;
a second MISFET including:
a second gate insulative film formed over a second region of the semiconductor substrate; and
a second gate electrode formed over the second insulative film; and
a non-volatile memory cell including:
a third gate insulative film formed over a third region of the semiconductor substrate;
a control gate electrode formed over the third insulative film;
a first silicon oxide film formed over the third region and one side wall of the control gate electrode;
a first silicon nitride film formed over the first silicon oxide film;
a second silicon oxide film formed over the first silicon nitride film; and
a memory gate electrode formed over the second silicon oxide film;
wherein the thickness of the first gate insulative film is smaller than that of the second gate insulative film; and
wherein the first and third gate insulative films are formed of a same layer.
12. A semiconductor device according to claim 11 , wherein the first gate electrode and the control gate electrode are formed of a same layer.
13. A semiconductor device according to claim 11 , wherein the first gate electrode, the second gate electrode and the control gate electrode are formed of the same layer.
14. A semiconductor device according to claim 11 , wherein the first gate electrode and the control gate electrode are formed of a silicon film doped with n-type impurities, respectively.
15. A semiconductor device according to claim 11 , wherein a writing operation of the non-volatile memory cell is performed by injecting hot electrons into the charge accumulation layer.
16. A semiconductor device according to claim 11 , wherein an erasing operation of the non-volatile memory cell is performed by injecting hot holes into the charge accumulation layer.
17. A semiconductor device according to claim 11 , wherein silicide layers are formed on the control gate electrode and the memory gate electrode.
18. A semiconductor device according to claim 17 , wherein the silicide layers are formed of cobalt silicide layers.
19. A semiconductor device according to claim 11 , wherein, in a gate length direction, a length of the memory gate electrode is smaller than that of the control gate electrode.