Semiconductor package, method for manufacturing a semiconductor package, an electronic device, method for manufacturing an electronic device
View Patent ↗A semiconductor package including a substrate with a semiconductor device mounted on the substrate and a resin member sealing the substrate and semiconductor device. The resin member includes a first surface and a second surface located on the other side of the first surface and a plurality of leads electrically connected with the semiconductor device. The leads project from the resin member and extend to the second surface side; wherein the second surface of the resin member includes a first area having a first concave portion and a second area having a second concave portion which is different from the first area, and the second concave portion is deeper than the first concave portion.
1. A semiconductor package comprising:
a substrate;
a semiconductor device mounted on the substrate;
a resin member sealing the substrate and semiconductor device, the resin member including a first surface and a second surface located on a side opposite to the first surface; and
a plurality of leads electrically connected with the semiconductor device, the leads projecting from the resin member and extending to the second surface side;
wherein the second surface of the resin member includes a first area having a first concave portion and a second area having a second concave portion, the second area is different from the first area, and the second concave portion is deeper than the first concave portion.
2. The semiconductor package according to claim 1 , wherein
a third concave portion is formed on a surface that is different from the second surface of the resin material.
3. The semiconductor package according to claim 1 , wherein
the resin member includes wax.
4. The semiconductor package according to claim 1 , wherein
the leads are L-type leads.
5. An electronic device, comprising:
a mounting board;
a semiconductor package including resin member and a plurality of leads projecting from the resin member and electrically connected with the mounting board; and
an adhesive bonding the semiconductor package with the mounting board;
wherein a surface of the resin member opposite to the mounting board includes a first area having a first concave portion and;
a second area having a second concave portion and being different from the first area, and the second concave portion is deeper than the first concave portion and is embedded with the adhesive.
6. The electronic device according to claim 5 , wherein
a third concave portion is formed on a surface that is different from the surface opposed to the mounting board.
7. The electronic device according to claim 5 , wherein
the second concave portion is formed at least up to an edge of the adhesive.
8. The electronic device according to claim 5 , wherein
the adhesive includes a thermosetting resin.
9. The electronic device according to claim 5 , wherein
the resin material includes wax.
10. The electronic device of claim 5 , wherein
the leads are L-type leads.