METHOD OF FORMING THIN METAL FILM AND THIN METAL FILM MANUFACTURED BY THE FORMING METHOD
An under-layer 2 comprising a coupling agent having a metal element to be transformed to an oxide is disposed on the surface of an inorganic oxide substrate 1 , and a liquid containing micro-fine metal particles dispersed therein is coated on the under-layer 2 to form a micro-fine metal particle layer 3 . Then, temperature is elevated to a metallizing temperature of the micro-fine metal particles, to form a thin metal film layer 5.
1 . A method of forming a metal film, comprising:
providing a coupling agent having a metal element to be transformed to an oxide on a substrate;
coating a liquid in which fine metal particles are dispersed on the coupling agent so as to form a fine metal particle layer; and
elevating a temperature to a temperature where the fine metal particles are metallized so as to form a metal film layer.
2 . The method of forming a metal film according to claim 1 , wherein the step of elevating the temperature is a step of heating an entire part of the inorganic oxide substrate by a heating furnace.
3 . The method of forming a metal film according to claim 1 , wherein the step of elevating the temperature is a step of irradiating a laser light so as to apply heat locally to the fine metal particles.
4 . The method of forming a metal film according to claim 3 , wherein the laser light is irradiated in a predetermined pattern over the fine metal particle layer.
5 . The method of forming a metal film according to claim 1 , wherein the substrate is an inorganic oxide substrate; and
the metal element to be transformed to the oxide includes at least one element of titanium, zirconium, and aluminum.
6 . The method of forming a metal film according to claim 1 , wherein the fine metal particles are comprised of an elemental metal.
7 . The method of forming a metal film according to claim 6 , wherein the elemental metal is silver or gold.
8 . The method of forming a metal film according to claim 1 , further comprising:
forming a metal plating film on the surface of the metal film layer.
9 . The method of forming a metal film according to claim 8 , wherein the metal plating film comprises copper.
10 . A metal film substrate formed by coating fine metal particles on the surface of a substrate and elevating the temperature to a metallizing temperature so as to form a metal film layer,
wherein a metal oxide is disposed between the substrate and the metal film layer.