PATTERN FORMING APPARATUS AND PATTERN FORMING METHOD
A pattern forming apparatus includes a liquid material application mechanism that includes an opening for applying a liquid material on a substrate, and a laser processing mechanism that includes an irradiation section for irradiating the liquid material applied on the substrate with laser light to immobilize the liquid material so that a pattern is formed. The laser processing mechanism is integrated with the liquid material application mechanism.
1 . A pattern forming apparatus, comprising:
a liquid material application mechanism that includes an opening for applying a liquid material on a substrate; and
a laser processing mechanism that includes an irradiation section for irradiating the liquid material applied on the substrate with laser light to immobilize the liquid material so that a pattern is formed,
wherein the laser processing mechanism is integrated with the liquid material application mechanism.
2 . The pattern forming apparatus according to claim 1 , wherein the liquid material applied on the substrate is sequentially processed and immobilized by the laser light.
3 . The pattern forming apparatus according to claim 1 , wherein a diameter of a region having an energy level of the laser light at which the liquid material is substantially immobilized is greater than a minimum representative dimension of the opening.
4 . The pattern forming apparatus according to claim 1 , wherein a diameter of a region having an energy level of the laser light at which the liquid material is substantially immobilized is smaller than a minimum representative dimension of the opening.
5 . The pattern forming apparatus according to claim 1 , wherein the liquid material application mechanism applies a plurality of kinds of liquid materials on the substrate separately or in combination.
6 . The pattern forming apparatus according to claim 1 , wherein the irradiation section includes an optical fiber through which the laser light propagates.
7 . The pattern forming apparatus according to claim 1 , further comprising:
an atmosphere control chamber that is integrated with the opening and the irradiation section respectively.
8 . The pattern forming apparatus according to claim 7 , wherein the atmosphere control chamber is maintained under a low oxygen concentration atmosphere so that the liquid material is not oxidized.
9 . The pattern forming apparatus according to claim 7 , wherein the atmosphere control chamber is maintained under a high oxygen concentration atmosphere so that the liquid material is not reduced.
10 . A pattern forming apparatus comprising:
a liquid material application mechanism that applies a liquid material on a substrate; and
a laser processing mechanism that irradiates and immobilizes the liquid material applied on the substrate with laser light,
wherein the liquid material application mechanism includes:
a liquid material supplying section which has an opening contacting the substrate through the liquid material; and
a transporting section which transports the liquid material to the liquid material supplying section;
wherein the laser processing mechanism includes an irradiation section which irradiates an irradiation target point with the laser light; and
wherein the liquid material is applied on the substrate from the opening and the liquid material applied on the substrate is sequentially processed and immobilized by the laser light emitted from the irradiation section.
11 . A pattern forming method comprising:
applying a liquid material on a substrate through an opening while contacting the opening to the substrate through the liquid material; and
sequentially processing and immobilizing the liquid material applied on the substrate by the laser light to form a pattern.
12 . The pattern forming method according to claim 11 , wherein the laser light process induces a process of causing the liquid material to a chemical change or a physical change.
13 . The pattern forming method according to claim 11 , wherein the liquid material applied on the substrate is processed by first laser light and then is processed by second laser light.
14 . The pattern forming method according to claim 13 , wherein a wavelength of the first laser light is different from a wavelength of the second laser light.
15 . The pattern forming method according to claim 13 , wherein a beam profile of the first laser light is different from a beam profile of the second laser light.
16 . The pattern forming method according to claim 11 , wherein a first pattern is formed using a first liquid material, and then, a second pattern is formed using a second liquid material.
17 . The pattern forming method according to claim 11 , wherein, after forming the pattern, a part of the liquid material which is not immobilized in the liquid material applied on the substrate is removed; and
wherein a whole of the substrate is post-processed after the part of the liquid material is removed.
18 . The pattern forming method according to claim 11 , wherein the liquid material includes metal ions or metal colloids.
19 . The pattern forming method according to claim 11 , wherein the liquid material includes oxide fine particles.
20 . The pattern forming method according to claim 11 , wherein the liquid material includes a surface modifying material.