IP Library Patent Application 12152258
Patent Application
App. No. 12/152,258

Temperature-controlled induction heating of polymeric materials

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Quick Facts
Patent No.
US None
App. No.
12/152,258
Filed
May 13, 2008
Examiner
VAN, QUANG T
Art Unit
3742
USPC
219/634
Abstract

The present invention provides new polymer induction bonding technology. Induction heating technologies are utilized to weld, forge, bond or set polymer materials. The invention provides controlled-temperature induction heating of polymeric materials by mixing ferromagnetic particles in the polymer to be heated. Temperature control is obtained by selecting ferromagnetic particles with a specific Curie temperature. The ferromagnetic particles will heat up in an induction field, through hysteresis losses, until they reach their Curie temperature. At that point, heat generation through hysteresis loss ceases. This invention is applicable to bonding thermoplastic materials, wherein only the area to be heated has ferromagnetic particles in it; bonding of thermoset composites, which have been processed with a layer of thermoplastic material on one side; curing of thermoset adhesives or composite resins; or consolidating thermoplastic composites.

Claims (20)

1 . An apparatus for controlling induction heating a thermoplastic material comprising:

at least one matrix material;

ferromagnetic, electrically non-conductive hexagonal ferrite particles having the composition SrFe 12 O 19 , Me a -2W, Me a -2Y, and Me a -2Z, wherein 2W is BaO:2 Me a O:8Fe 2 O 3 , 2Y is 2(BaO:Me a O:3Fe 2 O 3 ), and 2Z is 3BaO:2 Me a O:12Fe 2 O 3 , and wherein Me a is a divalent cation, or magnetically soft ferrite particles having the composition 1Me b O:1Fe 2 O 3 , where Me b O is a transition metal oxide, wherein the particles have a specific Curie temperature (T c ), and wherein the particles are in contact with the thermoplastic material;

an inductor for heating the particles to their Curie temperature; and

a power source connected to the inductor.

2 . The apparatus of claim 1 , wherein the particles are from about 1 micron to about 840 microns.

3 . The apparatus of claim 1 , wherein the particles are less than 1 micron.

4 . The apparatus of claim 1 , wherein the power source provides an alternating field of from about 500 KHz to about 10 MHz to the inductor, and wherein the frequency of the field is selected to optimize the efficiency and rate of heating during the bonding or curing process.

5 . The apparatus of claim 1 , wherein T c of the particles is less than the melting temperature of the thermoplastic material.

6 . The apparatus of claim 1 , wherein T c of the particles is greater than the melting temperature of the thermoplastic material.

7 . The apparatus of claim 1 , wherein Me a comprises Mg, Co, Mn or Zn and Me b comprises Ni, Co, Mn, or Zn.

8 . The apparatus of claim 1 , wherein the particles comprise SrFe 12 O 19 , Co-2Y, Mg-2Y, Zn/Co-2Y, or Zn/Mg-2Y or combinations thereof, (Mn, ZnO)Fe 2 O 3 or (Ni, ZnO)Fe 2 O 3 .

9 . The apparatus of claim 1 , wherein the thermoplastic material comprises a shaped polymeric material.

10 . The apparatus of claim 9 , further comprising a layer of distinct material laminated to the shaped polymeric material.

11 . The apparatus of claim 1 , wherein the thermoplastic material comprises PEEK, PEKK, PEI, PPS, PSU, PET, polyester, PA, PP, PE, PU, PPO, PC or combinations thereof.

12 . The apparatus of claim 9 , wherein the polymeric material is shaped by extrusion or compression molding or by a film casting process.

13 . The apparatus according to claim 1 , wherein the ferromagnetic particles are embedded in the surface of the thermoplastic material.

14 . The apparatus according to claim 1 , wherein the ferromagnetic particles are dispersed throughout the thermoplastic material.

15 . The apparatus according to claim 1 , wherein the inductor operates at a power between 1500 W-2300 W.

16 . The apparatus according to claim 1 , wherein the inductor has a frequency of 88 kHz-310 kHz.