Fixture for securing optoelectronic packages for wire and/or component bonding
View Patent ↗Generally, a fixture for securing optoelectronic packages may be used to secure one or more optoelectronic packages for mounting one or more components and/or one or more wires to at least first and second mounting surfaces at different relative angles. The fixture is rotatable between at least first and second mounting positions with a top surface of the fixture being at respective first and second mounting angles relative to a horizontal plane. The fixture may be configured to secure the optoelectronic package(s) for positioning at different mounting angles to facilitate mounting the components and/or wires to the mounting surfaces at the different angles. The fixture may also be configured to be continuously adjustable over a range of angles between the first and second mounting angles.
1. A fixture for securing a plurality of optoelectronic packages for mounting at least first and second wires or components on at least first and second mounting surfaces at different relative angles, the fixture comprising:
a base including a bottom surface and a generally opposing top surface at an angle relative to the bottom surface;
a holder rotatably coupled to the base, the holder including a top portion and a side portion, the top portion including a first end, an opposing second end and a top surface, the side portion including a first end, an opposing second end, a bottom surface and an outer side surface, the holder defining a plurality of passageways extending from the top surface of the top portion toward the bottom surface of the side portion and configured to receive the plurality of optoelectronic packages, wherein the holder and the base are configured such that the holder is rotatable between at least first and second mounting positions with the top surface of the top portion being at respective first and second mounting angles relative to a horizontal plane, wherein the top portion contacts the top surface of the base in the first mounting position and wherein the side portion contacts the top surface of the base in the second mounting position; and
a locker configured to secure the plurality of optoelectronic packages.
2. The fixture of claim 1 , wherein the first and second mounting angles include at least one mounting angle between 0° and 90° relative to the horizontal plane.
3. The fixture of claim 1 , wherein the base includes a magnetic region such that a magnetic force between the base and the holder draws at least one of the top portion and the side portion toward the base.
4. The fixture of claim 1 , wherein the angle of the top surface of the base relative to the bottom surface of the base is about 6°.
5. The fixture of claim 4 , wherein the first mounting angle is about 90° and wherein the second mounting angle is about 12°.
6. The fixture of claim 1 , further comprising an angular adjustment mechanism configured to contact at least one of the top portion and the side portion of the holder to adjust a position of the holder at other mounting angles between the first and second mounting angles.
7. The fixture of claim 1 , wherein the locker is a locking plate slidably coupled to the top portion of the holder.
8. The fixture of claim 7 , wherein the locking plate includes a plurality of slots along an edge, each of the plurality of slots configured to receive an alignment member of each of the plurality of optoelectronic packages.
9. The fixture of claim 1 , wherein the top portion of the holder defines a recess in the top surface about an end of each passageway, the recesses being configured to receive a portion of the plurality of optoelectronic packages.
10. The fixture of claim 1 , further comprising a heating element positioned adjacent the holder.
11. A method of bonding a wire or a component at a mounting angle in at least one optoelectronic package, the method comprising:
providing a fixture includes a base, a holder rotatably coupled to the base, and a locker coupled to the holder;
loading at least one optoelectronic package in the holder;
securing the optoelectronic package in the holder using the locker;
rotating the holder to at least a first mounting position, wherein a top surface of the holder is at a first mounting angle relative to a horizontal plane;
mounting at least one wire or component to a first mounting surface in the at least one optoelectronic package in the first mounting position;
rotating the holder to at least a second mounting position, wherein a top surface of the holder is at a second mounting angle relative to the horizontal plane; and
mounting at least one wire or component to a second mounting surface in the at least one optoelectronic package in the second mounting position.
12. The method of claim 11 further comprising adjusting an angular position of the holder with respect to the horizontal plane to another mounting angle between the first mounting angle and the second mounting angle.
13. The method of claim 11 , wherein the base includes an angled top surface and the holder includes a top portion and a side portion extending at an angle relative to the top portion, and wherein one of the top portion and the side portion contacts the angled top surface in the first mounting position and the other of the top portion and the side portion contacts the angled top surface in the second mounting position.
14. The method of claim 11 , wherein the first and second mounting angles include at least one mounting angle between 0° and 90° relative to the horizontal plane.
15. The method of claim 11 , wherein the first mounting angle is about 90° and wherein the second mounting angle is about 12°.
16. The method of claim 11 wherein the mounting includes bonding.
17. The method of claim 16 , wherein the bonding includes ultrasonic bonding.
18. The method of claim 16 , wherein the bonding includes thermosonic bonding or thermocompression bonding.
19. The method of claim 11 , further comprising heating the optoelectronic packages to a desired temperature.