System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices

1. A method of routing signals from bond fingers of a lead frame to a first die and a second die, the second die being positioned adjacent to the first die on the lead frame, the method comprising:

routing a first signal from a first bond finger to a first receiving segment of a first signal bus, the first receiving segment being positioned along a first outer edge of the first die in a direction parallel to the first outer edge of the first die, the first receiving segment having a length equal to at least a distance between the first bond finger and a second bond finger of the lead frame;

routing the first signal from the first receiving segment to a distribution segment of the first signal bus, the distribution segment being positioned along an inner edge of the first die in a direction parallel to the inner edge of the first die, the distribution segment having a length equal to at least a distance between a first bond pad and a third bond pad positioned along the inner edge of the first die;

routing the first signal from the distribution segment to the first bond pad to thereby provide the first signal to the first die; and

routing the first signal to the second die by routing the first signal from the distribution segment to a second bond pad positioned adjacent to an inner edge of the second die, the inner edge of the second die being adjacent to the inner edge of the first die.

2. The method of claim 1 , wherein the first signal comprises a first supply voltage.

3. The method of claim 2 , further comprising routing a second supply voltage from a third bond finger through a node on the first die to a node on the second die.

4. The method of claim 1 , wherein the first signal comprises an address, data, or control signal.

5. The method of claim 3 , wherein:

the first supply voltage comprises a core voltage for circuitry within the second die; and

the second supply voltage comprises input/output (I/O) power supply for powering I/O circuitry within the second die.

6. The method of claim 1 , wherein routing the first signal from the first receiving segment to the distribution segment is via a consolidator segment of the first signal bus.

7. The method of claim 6 , wherein the consolidator segment is elongated in a direction perpendicular to the first receiving segment.

8. The method of claim 1 , wherein routing the first signal to the second die further comprises:

routing the first signal from the distribution segment to the first bond pad of the first die; and

routing the first signal from the first bond pad of the first die to the second bond pad of the second die.

9. The method of claim 1 , wherein the first signal bus is located on a power redistribution layer of the first die, the power redistribution layer to route a plurality of signals to the first die and the second die.

10. The method of claim 1 , further comprising routing a second signal to the first die and the second die via a second signal bus.

11. The method of claim 1 , wherein the first signal bus further comprises a second receiving segment positioned along a second outer edge of the first die, the second receiving segment extending in a direction parallel to the second outer edge.

12. The method of claim 11 , wherein both the first and the second receiving segment are coupled to the distribution segment.

13. The method of claim 1 , wherein routing the first signal from the distribution segment to the second bond pad further comprises routing the first signal from the distribution segment to the second bond pad via a bond wire.