Printhead and method for controlling temperatures in drop forming mechanisms
An apparatus and method for controlling temperature profiles in ejection mechanisms is provided. A heater includes a first resistor segment having an electrical resistivity, a second resistor segment; and a coupling segment positioned between the first resistor segment and the second resistor segment. The coupling segment has an electrical resistivity, wherein the ratio of the resistivity of the coupling segment to the resistivity of the first resistor segment is substantially zero. Alternatively, the first resistor segment has an electrical conductivity and the coupling segment has an electrical conductivity, wherein the electrical conductivity of the coupling segment is greater than the electrical conductivity of the first resistor segment.
1. A printhead comprising:
a substrate including a nozzle; and
a drop forming mechanism disposed on the substrate, the drop forming mechanism including a plurality of straight resistor segments made of a first material and a plurality of coupling segments made of a second material, the plurality of straight resistor segments being positioned on every side of the nozzle, one of the plurality of coupling segments being positioned between two of the plurality of straight resistor segments, each of the plurality of coupling segments including a short current path and a long current path, the short current path and the long current path being present throughout each of the plurality of coupling segments such that current crowding exists throughout each of the plurality of coupling segments, each of the plurality of straight resistor segments having an electrical resistivity, each of the plurality of the coupling segments having an electrical resistivity, wherein the ratio of the resistivity of each of the plurality of coupling segments to the resistivity of each of the plurality of straight resistor segments is selected such that little or no heat is generated within each of the plurality of coupling segments even though current crowding still exists within each of the plurality of coupling segments, and wherein the first material and the second material are of the same material, the first material having a first doping and the second material having a second doping, the first doping being different when compared to the second doping.
2. A method of controlling temperatures in an ejection mechanism comprising:
providing an ejection mechanism including a substrate, the substrate including a nozzle;
providing a drop forming mechanism disposed on the substrate and positioned about the nozzle, the drop forming mechanism including a path for current to travel through, the path comprising a first straight resistor segment including a material that is doped, a coupling segment including a material that is doped, and a second straight resistor segment, the first straight resistor segment having an electrical conductivity, the coupling segment having an electrical conductivity, wherein the material of the coupling segment is doped more heavily than the material of the first resistor segment so that the electrical conductivity of the coupling segment is at least 100 times greater than the electrical conductivity of the first straight resistor segment such that little or no heat is generated within the coupling segment even though current crowding still exists within the coupling segment; and
causing current to travel through the path.
3. A printhead comprising:
a substrate including a nozzle; and
a drop forming mechanism disposed on the substrate and positioned about the nozzle, the drop forming mechanism including a first straight resistor segment having an electrical resistivity, the first straight resistor segment including a material that is doped, a second straight resistor segment, and a coupling segment positioned between the first straight resistor segment and the second straight resistor segment, the coupling segment having an electrical resistivity, the coupling segment including a material that is doped, wherein the material of the coupling segment is doped more heavily than the material of the first resistor segment so that the ratio of the resistivity of the coupling segment to the resistivity of the first straight resistor segment is at least 1 to 100 such that little or no heat is generated within the coupling segment even though current crowding still exists within the coupling segment.
4. A method of controlling temperatures in an ejection mechanism comprising:
providing an ejection mechanism including a substrate, the substrate including a nozzle;
providing a drop forming mechanism disposed on the substrate and positioned about the nozzle, the drop forming mechanism including a path for current to travel through, the path comprising a first straight resistor segment including a material that is doped, a coupling segment including a material that is doped, and a second straight resistor segment, the first straight resistor segment having an electrical resistivity, the coupling segment having an electrical resistivity, wherein the material of the coupling segment is doped more heavily than the material of the first resistor segment so that the ratio of the resistivity of the coupling segment to the resistivity of the first straight resistor segment is at least 1 to 100 such that little or no heat is generated within the coupling segment even though current crowding still exists within the coupling segment; and
causing current to travel through the path.
5. A printhead comprising:
a substrate including a nozzle; and
a drop forming mechanism disposed on the substrate and positioned about the nozzle, the drop forming mechanism including a first straight resistor segment having an electrical conductivity, the first resistor segment including a material that is doped, a second straight resistor segment, and a coupling segment positioned between the first straight resistor segment and the second straight resistor segment, the coupling segment having an electrical conductivity, the coupling segment including a material that is doped, wherein the material of the coupling segment is doped more heavily than the material of the first resistor segment so that the electrical conductivity of the coupling segment is at least 100 times greater than the electrical conductivity of the first straight resistor segment such that little or no heat is generated within the coupling segment even though current crowding still exists within the coupling segment.
6. The printhead according to claim 5 , wherein the coupling segment is shaped to transfer current from the first resistor segment to the second resistor segment.
7. The printhead according to claim 6 , wherein the shape of the coupling segment includes a straight portion.
8. The printhead according to claim 6 , wherein the shape of the coupling segment includes a radius of curvature.