Semiconductor device
View Patent ↗A semiconductor memory array includes a first nonvolatile memory cell having a first charge storage layer and a first gate electrode and a second nonvolatile memory cell, adjacent to the first memory cell in a first direction, having a second charge storage layer and a second gate electrode. The first and second electrodes extend in a second direction perpendicular to the first direction, the first electrode has a first contact section extending toward the second electrode in the first direction, and the second electrode has a second contact section extending toward the first electrode in the first direction. The first and second contact positions are shifted in the second direction, respectively, and the first electrode and the first contact section are electrically separated from the second electrode and the second contact section.
1. A semiconductor device comprising:
first and second memory array forming regions including a plurality of nonvolatile memory cells, wherein each of the nonvolatile memory cells includes a charge storage layer formed over a semiconductor substrate and a memory gate formed over the charge storage layer; and
a shunt region formed between the first and second memory array forming regions, wherein the shunt region is a region for supplying voltage to the memory gates of the nonvolatile memory cells;
wherein the memory gates of the nonvolatile memory cells are extended in a first direction, respectively, and are arranged in parallel,
wherein, in the shunt region, a plurality of wirings for supplying voltage are formed over the memory gates and extended in a second direction substantially perpendicular to the first direction;
wherein, in the shunt region, a plurality of the plugs are formed between the memory gates and the wirings, wherein each of the memory gates is respectively connected to one of the wirings through one of the plugs;
wherein one of the plugs is connected to a first contact section of one of the memory gates,
wherein another one of the plugs is connected to a second contact section of another one of the memory gates, and
wherein the first and second contact sections are shifted relative to each other in the first direction.
2. A semiconductor device according to the claim 1 ,
wherein the nth and n+8th to n+8mth (where n and m: integers) memory gates are connected to one another by the same wiring of the wirings.
3. A semiconductor device according to the claim 1 ,
wherein an element isolation region is formed in the semiconductor substrate, and
wherein the first and second contact sections are arranged over the element isolation region.
4. A semiconductor device according to the claim 3 ,
wherein the element isolation region is formed of a second insulating film embedded into a trench formed in the semiconductor substrate.
5. A semiconductor device according to the claim 1 ,
wherein the memory gates are formed in sidewall form.
6. A semiconductor device according to the claim 1 ,
wherein each of the memory gates is comprised of a polysilicon film, respectively, and
wherein silicide films are formed over the memory gates.
7. A semiconductor device according to the claim 6 ,
wherein the silicide films are comprised of cobalt silicide films.
8. A semiconductor device according to the claim 1 ,
wherein the charge storage layers include a silicon nitride film, respectively.
9. A semiconductor device comprising:
first and second memory array forming regions including a plurality of nonvolatile memory cells, wherein each of the nonvolatile memory cells includes a control gate formed over a semiconductor substrate, a charge storage layer formed over the semiconductor substrate, and a memory gate formed over the charge storage layer and formed over a side surface of a control gate; and
a shunt region formed between the first and second memory array forming regions, wherein the shunt region is a region for supplying voltage to the memory gates of the nonvolatile memory cells;
wherein the memory gates of the nonvolatile memory cells are extended in a first direction, respectively, and are arranged in parallel,
wherein, in the shunt region, a plurality of wirings for supplying voltage are formed over the memory gates and extended in a second direction substantially perpendicular to the first direction;
wherein, in the shunt region, a plurality of the plugs are formed between the memory gates and the wirings, wherein each of the memory gates is respectively connected to one of the wirings through one of the plugs;
wherein one of the plugs is connected to a first contact section of one of the memory gates,
wherein another one of the plugs is connected to a second contact section of another one of the memory gates, and
wherein the first and second contact sections are shifted relative to each other in the first direction.
10. A semiconductor device according to the claim 9 ,
wherein the nth and n+8th to n+8mth (where n and m: integers) memory gates are connected to one another by the same wiring of the wirings.
11. A semiconductor device according to the claim 9 ,
wherein an element isolation region is formed in the semiconductor substrate, and
wherein the first and second contact sections are arranged over the element isolation region.
12. A semiconductor device according to the claim 11 ,
wherein the element isolation region is formed of a second insulating film embedded into a trench formed in the semiconductor substrate.
13. A semiconductor device according to the claim 9 ,
wherein the memory gates are formed in sidewall form.
14. A semiconductor device according to the claim 9 ,
wherein each of the memory gates is comprised of a poly silicon film, respectively, and
wherein silicide films are formed over the memory gates.
15. A semiconductor device according to the claim 14 ,
wherein the silicide films are comprised of cobalt silicide films.
16. A semiconductor device according to the claim 9 ,
wherein the charge storage layers include a silicon nitride film, respectively.