Photonic MEMS and structures
An interference modulator (Imod) incorporates anti-reflection coatings and/or micro-fabricated supplemental lighting sources. An efficient drive scheme is provided for matrix addressed arrays of IMods or other micromechanical devices. An improved color scheme provides greater flexibility. Electronic hardware can be field reconfigured to accommodate different display formats and/or application functions. An IMod's electromechanical behavior can be decoupled from its optical behavior. An improved actuation means is provided, some one of which may be hidden from view. An IMod or IMod array is fabricated and used in conjunction with a MEMS switch or switch array. An IMod can be used for optical switching and modulation. Some IMods incorporate 2-D and 3-D photonic structures. A variety of applications for the modulation of light are discussed. A MEMS manufacturing and packaging approach is provided based on a continuous web fed process. IMods can be used as test structures for the evaluation of residual stress in deposited materials.
1. A device comprising:
a substrate;
a transparent conducting layer disposed over the substrate;
an absorber layer disposed over the substrate, wherein the absorber layer includes a semiconductor;
a reflector disposed over the substrate; and
an optical resonant cavity between the absorber layer and the reflector,
wherein a portion of incident light passing through the substrate is reflected by the reflector towards the absorber layer.
2. The device of claim 1 , wherein the substrate includes glass.
3. The device of claim 1 , wherein the transparent conducting layer includes indium tin oxide.
4. The device of claim 1 , wherein the transparent conducting layer is disposed between the reflector and the substrate.
5. The device of claim 1 , further comprising one or more dielectric films.
6. The device of claim 1 , further comprising one or more oxide films.
7. The device of claim 1 , including a lossy metal film.
8. The device of claim 7 , wherein the lossy metal film includes molybdenum.
9. The device of claim 1 , wherein the reflector includes a metallic reflector.
10. A device, comprising:
a substrate;
an optical stack disposed over the substrate, the optical stack including a transparent conducting layer and
an absorber, wherein the absorber includes a semiconductor;
a reflector disposed over the substrate; and
an optical resonant cavity between the optical stack and the reflector,
wherein a portion of incident light passing through the substrate is reflected by the reflector towards the absorber.
11. The device of claim 10 , wherein the substrate includes glass.
12. The device of claim 10 , wherein the transparent conducting layer includes ITO.
13. The device of claim 10 , wherein the optical stack includes a combination of metals and oxides.
14. The device of claim 10 , including a lossy metal film.
15. The device of claim 14 , wherein the lossy metal film includes molybdenum.
16. The device of claim 10 , wherein the reflector includes a metallic reflector.
17. A device comprising:
a substrate;
a transparent conducting layer disposed over the substrate;
an absorber layer disposed over the substrate, wherein the absorber includes a semiconductor;
a reflector disposed over the absorber layer; and
an optical resonant cavity between the absorber layer and the reflector,
wherein a portion of incident light passing through the substrate is reflected by the reflector towards the absorber layer.
18. The device of claim 17 , wherein the substrate includes glass.
19. The device of claim 17 , wherein the transparent conducting layer includes indium tin oxide.
20. The device of claim 17 , further comprising one or more dielectric films.
21. The device of claim 17 , further comprising one or more oxide films.
22. The device of claim 17 , including a lossy metal film.
23. The device of claim 22 , wherein the lossy metal film includes molybdenum.
24. The device of claim 17 , wherein the reflector includes a metallic reflector.