Semiconductor device having capacitor with upper electrode whose circumference is made long and its manufacture method
View Patent ↗A capacitor is formed over a semiconductor substrate. The capacitor includes a lower electrode, a capacitor dielectric film and an upper electrode in this order recited, and has an area S equal to or larger than 1000 μm 2 and L/S equal to or larger than 0.4 μm −1 , where S is an area of a capacitor region in which the lower and upper electrodes face each other across the dielectric film, and L is a total length of a circumference line of the capacitor region.
1. A semiconductor device comprising:
a semiconductor substrate; and
a capacitor formed over the semiconductor substrate, comprising a lower electrode, a capacitor dielectric film and an upper electrode stacked in an order recited, and having an area S equal to or larger than 1000 μm 2 and LT/S equal to or larger than 0.4 μm −1 , where S is an area of a capacitor region in which the lower and upper electrodes face each other across the dielectric film, and LT is a total length of a circumference line of the capacitor region.
2. The semiconductor device according to claim 1 , wherein the upper electrode is included within the lower electrode as viewed in plan, and a plan shape of the upper electrode comprises a stripe portion having a width equal to or narrower than 5 μm.
3. The semiconductor device according to claim 1 , wherein the upper electrode is included within the lower electrode as viewed in plan, and the upper electrode comprises a plurality of patterns isolated from each other.
4. The semiconductor device according to claim 3 , wherein each of the patterns of the upper electrode has a shape included within a square having one side length of 5 μm.
5. The semiconductor device according to claim 1 , further comprising
a power supply voltage line to be applied with a power supply voltage and a ground line to be applied with a ground voltage, respectively formed over the semiconductor substrate,
wherein one of the lower electrode and the upper electrode is connected to the power supply voltage line, and the other is connected to the ground line.
6. The semiconductor device according to claim 1 , wherein the capacitor dielectric film comprises ferroelectric material.
7. The semiconductor device according to claim 6 , further comprising:
a plurality of word lines formed over the semiconductor substrate and extending along a first direction;
a plurality of bit lines formed over the semiconductor substrate and extending along a second line crossing the word line;
a switching element disposed in correspondence with each of cross points of the word lines and the bit lines, a voltage applied to a corresponding word line controlling a conductive state between first and second terminals, and the first terminal being connected to a corresponding bit line;
an interlayer insulating film formed over the semiconductor substrate and covering the switching elements; and
a cell capacitor formed over the interlayer insulating film in correspondence with each of the cross points of the word lines and the bit lines, comprising a lower electrode, a capacitor dielectric film made of ferroelectric material and an upper electrode stacked in an order recited, one of the lower electrode and the upper electrode being connected to the second terminal of a corresponding switching element,
wherein the capacitor and the cell capacitor are disposed on the same interlayer insulating film and have a same lamination structure.
8. A semiconductor device comprising:
a semiconductor substrate; and
a capacitor formed over the semiconductor substrate, comprising a lower electrode, a capacitor dielectric film and an upper electrode stacked in an order recited,
wherein the upper electrode is included within the lower electrode as viewed in plan, and the upper electrode comprises a plurality of patterns isolated from each other, the plurality of patterns are electrically short-circuited with each other to be configured to serve as the upper electrode for the one capacitor.
9. The semiconductor device according to claim 8 , wherein a plan shape of each of the patterns of the upper electrode comprises a stripe portion having a width equal to or narrower than 5 μm.
10. The semiconductor device according to claim 8 , wherein each of the patterns of the upper electrode has a shape included within a square having one side length of 5 μm.
11. The semiconductor device according to claim 8 , wherein the capacitor dielectric film comprises ferroelectric material.
12. The semiconductor device according to claim 11 , further comprising:
a plurality of word lines formed over the semiconductor substrate and extending along a first direction;
a plurality of bit lines formed over the semiconductor substrate and extending along a second line crossing the word line;
a switching element disposed in correspondence with each of cross points of the word lines and the bit lines, a voltage applied to a corresponding word line controlling a conductive state between first and second terminals, and the first terminal being connected to a corresponding bit line;
an interlayer insulating film formed over the semiconductor substrate and covering the switching elements; and
a cell capacitor formed over the interlayer insulating film in correspondence with each of the cross points of the word lines and the bit lines, comprising a lower electrode, a capacitor dielectric film made of ferroelectric material and an upper electrode in an order recited, one of the lower electrode and the upper electrode being connected to the second terminal of the corresponding switching element,
wherein the capacitor and the cell capacitor are disposed on the same interlayer insulating film and have a same lamination structure.
13. A semiconductor device comprising:
a semiconductor substrate;
a capacitor formed over the semiconductor substrate, comprising a lower electrode, a capacitor dielectric film and an upper electrode stacked in an order recited; and
a power supply voltage line to be applied with a power supply voltage and a ground line to be applied with a ground voltage, respectively formed over the semiconductor substrate,
wherein the upper electrode is included within the lower electrode as viewed in plan, and the upper electrode comprises a plurality of patterns isolated form each other, and
wherein each of the patterns of the upper electrode is connected to one of the power supply voltage line and the ground line, and the lower electrode is connected to the other of the power supply voltage line and the ground line.
14. A manufacture method for a semiconductor device comprising:
forming over a semiconductor substrate a capacitor comprising a lower electrode, a capacitor dielectric film made of ferroelectric material and an upper electrode stacked in an order recited, and having an area S equal to or larger than 1000 μm 2 and LT/S equal to or larger than 0.4 μm −1 , where S is an area of a capacitor region in which the lower and upper electrodes face each other across the dielectric film, and LT is a total length of a circumference line of the capacitor region; and
heating the capacitor to improve a film quality of the capacitor dielectric film.
15. The manufacture method for a semiconductor device according to claim 14 , wherein the upper electrode is included within the lower electrode as viewed in plan, and a plan shape of the upper electrode comprises a stripe portion having a width equal to or narrower than 5 μm.
16. The manufacture method for a semiconductor device according to claim 14 , wherein the upper electrode is included within the lower electrode as viewed in plan, and the upper electrode comprises a plurality of patterns isolated from each other.
17. The manufacture method for a semiconductor device according to claim 16 , wherein each of the patterns of the upper electrode has a shape included within a square having one side length of 5 μm.
18. The manufacture method for a semiconductor device according to claim 14 , further comprising
forming a power supply voltage line to be applied with a power supply voltage and a ground line to be applied with a ground voltage, over the semiconductor substrate,
wherein one of the lower electrode and the upper electrode is connected to the power supply voltage line, and the other is connected to the ground line.
19. The manufacture method for a semiconductor device according to claim 14 , further comprising:
forming switching elements comprising a first terminal and a second terminal over the semiconductor substrate;
covering the switching elements with an interlayer insulating film;
forming a cell capacitor over the interlayer insulating film in correspondence with each of the switching elements, the cell capacitor comprising a lower electrode, a capacitor dielectric film made of ferroelectric material and an upper electrode; and
connecting the first terminal of the switching element to one of the upper electrode and the lower electrode of the corresponding cell capacitor,
wherein the capacitor and the cell capacitor are disposed on the same interlayer insulating film and formed at the same time.