IP Library Granted Patent US 8,186,221
Granted Patent B2
US 8,186,221 · App. 12/409,920 · Granted May 29, 2012

Vertically integrated MEMS acceleration transducer

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Quick Facts
Patent No.
US 8,186,221
App. No.
12/409,920
Granted
May 29, 2012
Kind
B2
Abstract

A transducer ( 20 ) includes sensors ( 28, 30 ) that are bonded to form a vertically integrated configuration. The sensor ( 28 ) includes a proof mass ( 32 ) movably coupled to and spaced apart from a surface ( 34 ) of a substrate ( 36 ). The sensor ( 30 ) includes a proof mass ( 58 ) movably coupled to and spaced apart from a surface ( 60 ) of a substrate ( 56 ). The substrates ( 36, 56 ) are coupled with the surface ( 60 ) of substrate ( 56 ) facing the surface ( 34 ) of substrate ( 36 ). Thus, the proof mass ( 58 ) faces the proof mass ( 32 ). The sensors ( 28, 30 ) are fabricated separately and can be formed utilizing differing micromachining techniques. The sensors ( 28, 30 ) are subsequently coupled ( 90 ) utilizing a wafer bonding technique to form the transducer ( 20 ). Embodiments of the transducer ( 20 ) may include sensing along one, two, or three orthogonal axes and may be adapted to detect movement at different acceleration sensing ranges.

Claims (35)

1. A transducer adapted to sense acceleration comprising:

a first substrate having a first surface;

a first proof mass movably coupled to said first surface and spaced apart from said first surface of said first substrate;

a second substrate having a second surface, said second substrate being coupled to said first substrate to form a hermetically sealed chamber with said second surface facing said first surface; and

a second proof mass movably coupled to said second surface and spaced apart from said second surface of said second substrate, said first proof mass and said second proof mass being located in said hermetically sealed chamber, and said second proof mass being situated facing said first proof mass.

2. A transducer as claimed in claim 1 further comprising an anchor system formed on said first surface of said first substrate and coupled with said first proof mass, said anchor system enabling said first proof mass to move substantially parallel to said first surface of said first substrate in response to said acceleration in a first direction.

3. A transducer as claimed in claim 2 further comprising:

movable fingers formed in said first proof mass and arranged perpendicular to said first direction; and

fixed sense fingers in non-movable connection with said first substrate and arranged substantially parallel to said movable fingers, each of said movable fingers being disposed between a pair of said fixed sense fingers to form a differential capacitive structure.

4. A transducer as claimed in claim 2 wherein said anchor system further enables said first proof mass to move substantially parallel to said first surface of said first substrate in response to said acceleration in a second direction, said second direction being orthogonal to said first direction.

5. A transducer as claimed in claim 2 wherein said anchor system is a first anchor system, and said transducer further comprises a second anchor system formed on said second surface of said second substrate and coupled with said second proof mass to enable said second proof mass to move substantially parallel to said second surface of said second substrate in response to said acceleration in said first direction.

6. A transducer as claimed in claim 5 further comprising:

a first sensor adapted to detect said acceleration in said first direction over a first sensing range, said first proof mass forming a portion of said first sensor; and

a second sensor adapted to detect said acceleration in said first direction over a second sensing range, said second proof mass forming a portion of said second sensor, and said second sensing range differing from said first sensing range.

7. A transducer as claimed in claim 1 wherein said second proof mass is adapted for motion relative to a rotational axis, and said transducer further comprises an anchor system formed on said second surface of said second substrate and pivotally coupled with said second proof mass, said anchor system enabling said second proof mass to rotate about said rotational axis in response to said acceleration in a direction perpendicular to said second surface of said second substrate.

8. A transducer as claimed in claim 7 wherein:

said second proof mass comprises first and second ends, a first section is formed between said rotational axis and said first end, a second section is formed between said rotational axis and said second end, said first section exhibiting a greater mass than said second section; and

said transducer further comprises first and second electrode elements formed on said second surface of said second substrate, said first electrode element facing said first section, said second electrode element facing said second section, and each of said first and second electrode elements being adapted to sense said acceleration in said direction perpendicular to said second surface.

9. A transducer as claimed in claim 7 wherein said anchor system is a first anchor system, and said transducer further comprises:

fixed sense fingers formed on said first surface of said first substrate, said second proof mass being situated facing a first portion of said fixed sense fingers;

a third proof mass movably coupled to said second surface and spaced apart from said second surface of said second substrate, said third proof mass being situated facing a second portion of said fixed sense fingers; and

a second anchor system formed on said second surface of said second substrate and pivotally coupled with said third proof mass at a second rotational axis, said second anchor system enabling said third proof mass to rotate about said second rotational axis in response to said acceleration in said direction perpendicular to said second surface.

10. A transducer as claimed in claim 1 further comprising an over-travel stop positioned between said first proof mass and said second proof mass, said over-travel stop being in non-movable connection with one of said first and second surfaces, said over-travel stop being adapted to limit movement of at least one of said first and second proof masses in a direction perpendicular to said first and second surfaces of said first and second substrates.

11. A transducer as claimed in claim 10 wherein said over-travel stop is a first over-travel stop in non-movable connection with said first surface and adapted to limit movement of said second proof mass in said direction, and said transducer further comprises a second over-travel stop positioned between said first proof mass and said second proof mass, said second over-travel stop being in non-movable connection with said second surface and adapted to limit movement of said first proof mass in said direction.

12. A transducer as claimed in claim 1 wherein said second proof mass is in opposing relationship with fixed sense fingers formed on said first surface of said first substrate, said second proof mass being spaced apart from said fixed sense fingers by a gap having a width sufficient to limit crosstalk capacitance between said second proof mass and said fixed sense fingers.

13. A method of producing a microelectromechanical systems (MEMS) transducer adapted to sense acceleration comprising:

forming a first sensor adapted to detect said acceleration, said first sensor including a first substrate having a first surface, a first proof mass movably coupled to said first surface and positioned in spaced apart relationship above said first surface, and first fixed electrodes formed on said first surface;

forming a second sensor adapted to detect said acceleration, said second sensor including a second substrate having a second surface, a second proof mass movably coupled to said second surface and positioned in spaced apart relationship above said first surface, and second fixed electrodes formed on said second surface; and

after forming said first and second sensors, coupling said second substrate to said first substrate to form a hermetically sealed chamber such that said second surface faces said first surface, said first proof mass and said second proof mass being located in said hermetically sealed chamber, and said second proof mass is situated facing said first proof mass.

14. A method as claimed in claim 13 wherein:

said forming said first sensor includes forming a first anchor system on said first surface of said first substrate, said first anchor system being coupled with said first proof mass, said first anchor system enabling said first proof mass to move substantially parallel to said first surface of said first substrate in response to said acceleration in a first direction; and

said forming said second sensor include forming a second anchor system of said second surface of said second substrate, said second anchor system being pivotally coupled with said second proof mass at a rotational axis to enable said second proof mass to rotate about said rotational axis in response to said acceleration in a second direction, said second direction being perpendicular to said second surface of said second substrate.

15. A method as claimed in claim 13 wherein:

said forming said first sensor includes forming a first anchor system on said first surface of said first substrate, said first anchor system being coupled with said first proof mass, said first anchor system enabling said first proof mass to move substantially parallel to said first surface of said first substrate in response to said acceleration in a first direction, wherein said first sensor is adapted to detect said acceleration in said first direction over a first sensing range; and

said forming said second sensor includes forming a second anchor system on said second surface of said second substrate, said second anchor system being coupled with said second proof mass, said second anchor system enabling said second proof mass to move substantially parallel to said second surface of said second substrate in response to said acceleration in said first direction, wherein said second sensor is adapted to detect said acceleration in said first direction over a second sensing range that differs from said first sensing range.

Assignments (25)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
PATENT RELEASE Recorded Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 4, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NORTH STAR INNOVATIONS INC.
Reel/Frame 037694/0264 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037354/0793 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030633/0424 →
SECURITY AGREEMENT Recorded May 19, 2009
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A.
Reel/Frame 022703/0405 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 24, 2009
From: LIN, YIZHEN; MILLER, TODD F.; PARK, WOO TAE
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 022442/0526 →