Electro-optic device packages
View Patent ↗A package design for electro-optic devices has been developed in which the substrate supporting the electro-optic element serves also as the base of the device housing. The electro-optic element is flip-chip bonded to the substrate. In a preferred embodiment the substrate is a multi-level wiring board.
1. An electro-optic device package comprising:
an electro-optic element comprising an electro-optic body having a top surface and a bottom surface, with an optical waveguide formed in the top surface, an optical fiber input to the optical waveguide, an optical fiber output from the optical waveguide, and electrodes on the top surface of the electro-optic body for impressing an electric field on the optical waveguide, wherein the optical fiber input is located at one end of the electro-optic body and the optical fiber output is located at an opposite end of the electro-optic body; and
a housing enclosing the electro-optic element, the housing comprising a bottom and a cover, with the bottom consisting of a laminated resin substrate, with the electro-optic element bonded to the laminated resin substrate, and with the cover attached to the bottom.
2. The electro-optic device package of claim 1 wherein the laminated resin substrate comprises a multi-level printed circuit board (MLPCB) with a top level, and at least one lower electrical interconnection level.
3. The electro-optic device package of claim 2 wherein the electro-optic body is flip-chip mounted on the top level.
4. The electro-optic device package of claim 2 wherein the electrodes are bonded to the top level of the MLPCB.
5. The electro-optic device package of claim 4 further comprising printed circuit runners on the at least one lower electrical interconnection level, with the printed circuit runners electrically interconnected to the electrodes bonded to the top level of the MLPCB.
6. The electro-optic device package of claim 1 wherein the electro-optic body comprises lithium niobate.
7. The electro-optic device package of claim 6 wherein the cover comprises a polymer material.
8. The electro-optic device package of claim 7 wherein the cover is attached with adhesive.
9. The electro-optic device package of claim 1 wherein the laminated resin substrate is FR-4.
10. The electro-optic device package of claim 1 wherein the housing is not filled with polymer material.
11. An electro-optic device package comprising:
an electro-optic element comprising an electro-optic body having a top surface and a bottom surface, with an optical waveguide formed in the top surface, an optical fiber input to the optical waveguide, an optical fiber output from the optical waveguide, and electrodes on the top surface of the electro-optic body for impressing an electric field on the optical waveguide; and
a housing enclosing the electro-optic element, the housing comprising a cover and a bottom consisting of a laminated resin substrate, wherein the cover is attached to the bottom such that the cover does not extend beyond outer edges of an upper surface of the laminated resin substrate.
12. The electro-optic device package of claim 11 , wherein a top surface of the cover is substantially parallel to the upper surface of the laminated resin substrate.