IP Library Granted Patent US 7,859,016
Granted Patent B2
US 7,859,016 · App. 12/498,692 · Granted Dec 28, 2010

Thin film semiconductor device, polycrystalline semiconductor thin film production process and production apparatus

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Quick Facts
Patent No.
US 7,859,016
App. No.
12/498,692
Granted
Dec 28, 2010
Kind
B2
Abstract

A process for producing an image display device using a thin film semiconductor device is provided which includes forming a polycrystalline semiconductor thin film on a substrate. A substantially belt-shaped crystal is formed which is crystallized so as to grow crystal grains in a direction substantially parallel to a scanning direction of a CW laser beam by scanning the CW laser beam along the substrate, thereby irradiating the CW laser beam on portions of the polycrystalline semiconductor thin film formed onto the substrate.

Claims (12)

1. A thin film transistor comprising:

a polycrystalline silicon film in a channel region in which a main orientation of the polycrystalline silicon film is { 110 } with respect to a substrate and a main orientation of the polycrystalline silicon film perpendicular to a direction from a source region to a drain region is { 100 }.

2. The thin film transistor according to claim 1 , further comprising:

a gate electrode formed on the channel region through a gate insulating film.

3. The thin film transistor according to claim 1 , further comprising:

a gate electrode formed below the channel region through a gate insulating film.

4. A thin film transistor comprising:

a polycrystalline semiconductor film in a channel region in which a main orientation of the polycrystalline semiconductor film is { 110 } with respect to a substrate and a main orientation of the polycrystalline semiconductor film perpendicular to a direction from a source region to a drain region is { 100 }.

5. The thin film transistor accordingly to claim 4 , further comprising:

a gate electrode formed on the channel region through a gate insulating film.

6. The thin film transistor accordingly to claim 4 , further comprising:

a gate electrode formed below the channel region through a gate insulating film.

Assignments (3)
COMPANY SPLIT PLAN TRANSFERRING FIFTY (50) PERCENT SHARE OF PATENTS AND PATENT APPLICATIONS Recorded Dec 12, 2011
From: HITACHI DISPLAYS, LTD.
To: IPS ALPHA SUPPORT CO., LTD.
Reel/Frame 027362/0466 →
COMPANY SPLIT PLAN TRANSFERRING ONE HUNDRED (100) PERCENT SHARE OF PATENT AND PATENT APPLICATIONS Recorded Dec 12, 2011
From: HITACHI, LTD.
To: HITACHI DISPLAYS, LTD.
Reel/Frame 027362/0612 →
MERGER/CHANGE OF NAME Recorded Dec 12, 2011
From: IPS ALPHA SUPPORT CO., LTD.
To: PANASONIC LIQUID CRYSTAL DISPLAY CO., LTD.
Reel/Frame 027363/0315 →