Semiconductor device and method of manufacturing the same
View Patent ↗According to the present invention, a method of fabricating a semiconductor device is provided including forming a first interlayer insulating film 11 , a crystalline conductive film 21 , a first conductive film 23 , a ferroelectric film 24 and a second conductive film 25 on a silicon substrate 1 in sequence, forming a conductive cover film 18 on the second conductive film 25 , forming a hard mask 26 a on the conductive cover film 18 , forming a capacitor upon etching the conductive cover film 18 , the second conductive film 25 , the ferroelectric film 24 and the first conductive film 23 using the hard mask 26 a as an etching mask in areas exposed from the hard mask 26 a , and etching the hard mask 26 a and the crystalline conductive film 21 exposed from the lower electrode 23 a using an etching condition under which the hard mask 26 a is etched.
1. A method of manufacturing a semiconductor device, the method comprising:
forming a first interlayer insulating film over a semiconductor substrate;
forming a crystalline conductive film on the first interlayer insulating film;
forming a first conductive film on the crystalline conductive film;
forming a ferroelectric film on the first conductive film;
forming a second conductive film on the ferroelectric film;
forming a conductive cover film, made of platinum-group element except for iridium, on the second conductive film;
forming a hard mask on the conductive cover film;
etching the conductive cover film, the second conductive film, the ferroelectric film and the first conductive film in areas exposed from the hard mask, while using the hard mask as an etching mask, to form a capacitor including an upper electrode made of the second conductive film, a capacitor dielectric film made of the ferroelectric film, and a lower electrode made of the first conductive film, wherein side surfaces of the upper electrode, the capacitor dielectric film and the lower electrode reside in the same plane; and
etching the hard mask and the crystalline conductive film in areas exposed from the lower electrode using an etching condition under which the hard mask is etched,
wherein the forming of the second conductive film comprises:
forming a first conductive metal oxide film on the ferroelectric film; and
forming a second conductive metal oxide film on the first conductive metal oxide film,
wherein a relation y2/y1>x2/x1 holds for compositions AO x1 and BO y1 (A and B represent metallic elements), where AO x1 and BO y1 being stoicheiometric compositions of first and second metal oxide constituting the first and second conductive metal oxide film respectively, and for AO x2 and BO y2 , where AO x2 and BO y2 being actual compositions of the first and second metal oxides respectively.
2. The method of manufacturing the semiconductor device according to claim 1 , further comprising:
exposing a side surface of the capacitor to an etching solution after etching the hard mask and the crystalline conductive film.
3. The method of manufacturing the semiconductor device according to claim 1 , wherein any one of a platinum film, a ruthenium film, a rhodium film and a palladium film is employed as the conductive cover film.
4. The method of manufacturing the semiconductor device according to claim 1 , wherein the forming of the first conductive metal oxide film is carried out by a reactive sputtering method using sputtering gas containing oxygen and inert gas, and
the forming of the second conductive metal oxide film is carried out by a reactive sputtering method using sputtering gas containing oxygen and inert gas, where a flow rate ratio of oxygen in the sputtering gas is higher than in the forming of the first conductive metal oxide film.
5. The method of manufacturing the semiconductor device according to claim 1 , further comprising:
annealing the first conductive metal oxide film in an atmosphere containing oxidative gas before forming the second conductive metal oxide film.
6. The method of manufacturing the semiconductor device according to claim 1 , further comprising:
annealing the second conductive metal oxide film under a condition where an upper surface of the second conductive metal oxide film is exposed.
7. The method of manufacturing the semiconductor device according to claim 1 , wherein, in the forming of the second conductive metal oxide film, the second conductive metal oxide film is formed thicker than the first conductive metal oxide film.
8. The method of manufacturing the semiconductor device according to claim 1 , further comprising:
forming a conductivity improving film, made of metallic elements different from metallic elements constituting the conductive cover film, on the second conductive metal oxide film,
wherein the conductive cover film is formed on the conductivity improving film.
9. The method of manufacturing the semiconductor device according to claim 6 , further comprising:
forming a second interlayer insulating film covering the capacitor;
forming a hole in the conductive cover film and the second interlayer insulating film over the upper electrode in depth reaching the conductivity improving film; and
forming a conductive plug, made of a glue film and a conductive plug film formed in sequence, in the hole.