Semiconductor device and manufacturing method thereof

1. A method of manufacturing a semiconductor device comprising the steps of:

forming a gate electrode via a gate insulating film on a semiconductor substrate;

forming source/drain extension regions in the semiconductor substrate using the gate electrode as a mask;

forming carbon layers such that each of the carbon layers is offset from the front edge of the associated source/drain extension region in a direction away from the gate electrode;

forming source/drain impurity diffusion regions such that each of the source/drain impurity diffusion regions is offset from the channel-side boundary of the associated carbon layer so as to be away from the gate electrode and is located shallower than the depth-direction boundary of the carbon layer; and

forming a pocket region in the semiconductor substrate such that the associated source/drain extension region is located shallower than the pocket region,

wherein the carbon layer is formed so as to be offset from the front edges of the pocket region and the source/drain extension region in the direction away from the gate electrode.

2. The method of manufacturing a semiconductor device according to claim 1 , further comprising the steps of:

forming first sidewall spacers on both sides of the gate electrode after the source/drain extension regions are formed;

introducing carbon ions in the semiconductor substrate using the gate electrode and the first sidewall spacers as masks;

forming second sidewall spacers covering the first sidewall spacers; and

forming the source/drain impurity diffusion regions such that a peak of each of the source/drain impurity diffusion regions is located shallower than the boundary of the associated carbon layer.

3. The method of manufacturing a semiconductor device according to claim 1 , further comprising the steps of:

forming first sidewall spacers on both sides of the gate electrode after the source/drain extension regions are formed;

forming a first part of the source/drain impurity diffusion region in the surface area of the semiconductor substrate using the gate electrode and the first sidewall spacer as masks;

introducing carbon ions in the semiconductor substrate using the gate electrode and the first sidewall spacers as masks such that the peak of the carbon layer is located below a bottom of the first part of the source/drain impurity diffusion region;

forming second sidewall spacers covering the first sidewall spacers; and

forming a second part of the source/drain impurity diffusion regions such that a peak of the second part of the source/drain impurity diffusion regions is located shallower than the boundary of the carbon layer.

4. The method of manufacturing a semiconductor device according to claim 1 , further comprising the steps of:

forming sidewall spacers on both sides of the gate electrode after the source/drain extension regions are formed;

forming the source/drain impurity regions using the gate electrode and the sidewall spacers as masks; and

introducing carbon ions in the semiconductor substrate by oblique ion implantation using the gate electrode and the sidewall spacers as masks such that a peak of the carbon layer is located below the source/drain impurity diffusion regions.

5. The method of manufacturing a semiconductor device according to claim 4 , wherein the oblique ion implantation of carbon ions is performed such that the carbon layer is offset from the front edge of the source/drain extension region in the direction away from the gate electrode and that the carbon layer surrounds in profile the source/drain impurity diffusion region.

6. The method of manufacturing a semiconductor device according to claim 1 , wherein the carbon layer is formed by ion implantation at acceleration energy of 3 keV to 10 keV.

7. A method of manufacturing a semiconductor device comprising:

forming a gate insulating film on a semiconductor substrate;

forming a gate electrode on the gate insulating film;

implanting first impurities into the semiconductor substrate to form source/drain extension regions in the semiconductor substrate using the gate electrode as a mask;

implanting second impurities into the semiconductor substrate to form a pocket region in the semiconductor substrate using the gate electrode as a mask such that the associated source/drain extension region is located shallower than the pocket region;

after forming the source/drain extension region and the pocket region, forming first sidewall spacers on both sides of the gate electrode;

implanting carbon into the semiconductor substrate to form carbon layers in the semiconductor substrate using the gate electrode and the first side wall as masks; and

implanting third impurities into the semiconductor substrate to form source/drain impurity diffusion regions such that each of the source/drain impurity regions is located shallower than the carbon layers.

8. The method of manufacturing the semiconductor device according to claim 7 , wherein each of the carbon layers is offset from an edge of the associated source/drain extension region in a direction away from the gate electrode.