IP Library Granted Patent US 8,013,947
Granted Patent B2
US 8,013,947 · App. 12/591,874 · Granted Sep 6, 2011

Display device and manufacturing method of the same

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Quick Facts
Patent No.
US 8,013,947
App. No.
12/591,874
Granted
Sep 6, 2011
Kind
B2
Abstract

Conventionally, when a protective/insulation film is present above a film to be corrected, only a defect of the film to be corrected below such an upper-layer film is corrected without damaging the upper-layer film. A display region of a display device has an insulation film, a semiconductor film and a conductive film formed in a given pattern and stacked on a substrate. When at least one of a correction portion out of a correction portion which separates a short-circuit defect, a correction portion which connects an opening defect, a correction portion which removes a standard deviation defect, and a correction portion which separates a standard deviation defect of the pattern is corrected, at least one upper-layer film is present above a film to be corrected at the correction portion and the correction is applied to the film to be corrected while leaving the upper-layer film intact.

Claims (19)

1. A manufacturing method of a display device comprising:

a film forming step in which a plurality of films including an insulation film, a semiconductor film and a conductive film are stacked onto a substrate; and

a defect portion correcting step in which at least one correction out of a short-circuit defect portion separation correction which separates a short-circuit defect, an open defect portion connection correction which performs a connection of an open defect, a standard deviation defect portion removal correction which performs a removal of a standard deviation defect, and a standard deviation defect portion separation correction which performs a separation of a standard deviation defect portion generated in the formed film is performed, wherein

at a point of correction time of the defect portion correction step, at least one upper-layer film is present above a film to be corrected at the correction portion and the correction is applied to the film to be corrected while leaving the upper-layer film as it is,

the correction is performed by irradiating laser beams,

an output of the laser beams is set to 0.02 W/cm 2 or less,

the laser beams are irradiated from above the substrate through the upper-layer film to the correction portion, and

a wavelength of the laser beams is set to a wavelength that allows the laser beams to be more easily absorbed in the film to be corrected than in the upper-layer film.

2. A manufacturing method of a display device according to claim 1 , wherein the laser beams are irradiated to the same portion by dividing the laser beams plural times.

3. A manufacturing method of a display device according to claim 2 , wherein the laser beams are irradiated to the same portion by dividing the laser beams at least 10 times.

4. A manufacturing method of a display device according to claim 2 , wherein an irradiation interval of the laser beams is equal to or more than 0.3 seconds.

5. A manufacturing method of a display device according to claim 1 , wherein when the film to be corrected is an amorphous silicon semiconductor film, a wavelength of the laser beams is set to 250 nm to 360 nm.

6. A manufacturing method of a display device according to claim 1 , wherein the laser beams to be irradiated to the same portion are irradiated by dividing the laser beams 10 or more times.

7. A manufacturing method of a display device according to claim 1 , wherein the upper-layer film includes at least either one of an insulation film and a transparent conductive film.

8. A manufacturing method of a display device according to claim 1 , wherein the semiconductor film is an amorphous semiconductor film and the amorphous semiconductor film is subjected to the separation correction or the removal correction.

9. A manufacturing method of a display device according to claim 1 , wherein an activated layer of a thin film transistor which has a source electrode and a drain electrode is constituted by the semiconductor film, the semiconductor film includes an intrinsic semiconductor film and a contact film formed over the intrinsic semiconductor film, wherein the separation correction of a defect which short-circuits the source electrode and the drain electrode through the contact film is performed by removing the contact film present between the source electrode and the drain electrode together with a portion of the intrinsic semiconductor film.

10. A manufacturing method of a display device according to claim 1 , wherein the conductive film is at least one of a scanning signal line, a video signal line and a pixel electrode, and the separation correction is at least one of corrections of a short-circuit defect between the scanning signal lines, a short-circuit defect between the video signal lines and a short-circuit defect between the pixel electrodes.

11. A manufacturing method of a display device according to claim 10 , wherein the pixel electrode is a transparent conductive film.

12. A manufacturing method of a display device according to claim 1 , wherein a normal display is performed by the correction.

Assignments (3)
MERGER Recorded Dec 13, 2011
From: IPS ALPHA SUPPORT CO., LTD.
To: PANASONIC LIQUID CRYSTAL DISPLAY CO., LTD.
Reel/Frame 027482/0140 →
ATTACHED ARE (1) THE COMPANY SPLIT DOCUMENTS IN JAPANESE WITH ENGLISH TRANSLATION THEREOF AND (2) THE CERTIFICATE OF COMPANY SPLIT DOCUMENT IN JAPANESE WITH ENGLISH TRANSLATION, WHICH TOGETHER CONVEY 50% OWNERSHIP OF THE REGISTERED PATENTS AS LISTED IN THE ATTACHED TO EACH OF THE RECEIVING PARTIES (SEE PAGE 10, EXHIBIT 2-1, SECTION 1 OF THE ENGLISH TRANSLATION OF THE COMPANY SPLIT PLAN.) Recorded Dec 13, 2011
From: HITACHI, DISPLAYS, LTD.
To: HITACHI DISPLAYS, LTD.; IPS ALPHA SUPPORT CO., LTD.
Reel/Frame 027615/0589 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 3, 2009
From: KIYA, YOSHIYUKI; WATANABE, KUNIHIKO; HORII, TOSHIKAZU; TAKANO, TAKAO
To: HITACHI DISPLAYS, LTD.
Reel/Frame 023633/0042 →