IP Library Granted Patent US 8,720,022
Granted Patent B2
US 8,720,022 · App. 12/647,071 · Granted May 13, 2014

Method of producing an acoustic wave device

Inventors: Satoru Matsuda (Kawasaki, JP); Michio Miura (Kawaski, JP); Takashi Matsuda (Kawasaki, JP)
Assignee: Taiyo Yuden Co., Ltd.
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Quick Facts
Patent No.
US 8,720,022
App. No.
12/647,071
Granted
May 13, 2014
Kind
B2
Abstract

A method of producing an acoustic wave device includes: forming an interdigital electrode on a piezoelectric substrate; forming a barrier film so as to cover the interdigital electrode; forming a medium on the barrier film; measuring a frequency characteristic of an acoustic wave excited by the interdigital electrode; and forming, in an excitation region, an adjustment region having a thickness different from other portions by patterning the barrier film or further providing an adjustment film. When forming the adjustment region, an area T of the adjusting area is adjusted in accordance with the measured frequency characteristic.

Claims (18)

1. A method of producing an acoustic wave device, comprising:

forming an interdigital transducer having a pair of comb-shaped electrodes on a piezoelectric substrate;

forming a barrier film so as to cover the interdigital transducer;

forming a medium on the barrier film;

measuring a frequency characteristic of an acoustic wave excited by the interdigital transducer;

forming, within an excitation region directly over the pair of comb-shaped electrodes where the acoustic wave is excited by the pair of comb-shaped electrodes, an adjustment region having a surface area T as viewed from a top view and a thickness different from other portions of the excitation region in the same layer of the barrier film by patterning the barrier film or further providing an adjustment film; and

adjusting a frequency characteristics of the acoustic wave by adjusting the surface area T of the adjustment region when forming the adjustment region.

2. The method of producing an acoustic wave device according to claim 1 , wherein

when forming the interdigital transducer, interdigital transducers corresponding to a plurality of acoustic wave devices are formed on the piezoelectric substrate,

when measuring the frequency characteristic, a distribution of a frequency characteristic of the plurality of acoustic wave devices is measured, and

when forming the adjustment region, the adjustment region is such that the surface area T varies in accordance with the frequency characteristic distribution of the plurality of acoustic wave devices.

3. The method of producing an acoustic wave device according to claim 1 , wherein

when measuring the frequency characteristic, a frequency characteristic of each acoustic wave device on the piezoelectric substrate is measured, and

when forming the adjustment region, the surface area T of the adjustment region is determined on the basis of a difference between the measured frequency characteristic of the acoustic wave device and a predetermined reference frequency characteristic.

4. The method of producing an acoustic wave device according to claim 1 , wherein the step of adjusting includes adjusting the surface area T of the adjustment region without adjusting the thickness of the adjustment region.

5. The method of producing an acoustic wave device according to claim 4 , wherein the step of adjusting includes adjusting the ratio of the surface area T of the adjustment region relative to a surface area of the excitation region.

6. The method of producing an acoustic wave device according to claim 1 , wherein the step of adjusting includes adjusting the ratio of the surface area T of the adjustment region relative to a surface area of the excitation region.

7. The method of producing an acoustic wave device according to claim 1 , wherein in the step of adjusting the frequency characteristics of the acoustic wave, the surface area T of the adjustment region is adjusted without changing the thickness of the adjustment region.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 13, 2010
From: FUJITSU LIMITED
To: TAIYO YUDEN CO., LTD.
Reel/Frame 024369/0993 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 20, 2010
From: MATSUDA, SATORU; MIURA, MICHIO; MATSUDA, TAKASHI
To: FUJITSU LIMITED
Reel/Frame 023817/0344 →
Priority Claims (1)
JP 2009-074041 · Mar 25, 2009 · national
Continuity (1)
Related Publication 20100244624A1 · Sep 30, 2010