Semiconductor device and method for fabricating the same
View Patent ↗In a semiconductor device including: an insulating film ( 6 ) formed over a substrate ( 1 ); a buried metal interconnect ( 10 ) formed in the insulating film ( 6 ); and a barrier metal film (A 1 ) formed between the insulating film ( 6 ) and the metal interconnect ( 10 ), the barrier metal film (A 1 ) includes a metal oxide film ( 7 ), a metal compound film ( 8 ) and a metal film ( 9 ) stacked in this order from a side in which the insulating film ( 6 ) exists to a side in which the metal interconnect ( 10 ) exists. Elastic modulus of the metal compound film ( 8 ) is larger than that of the metal oxide film ( 7 ).
1. A semiconductor device including an insulating film formed on a substrate, a buried metal interconnect formed in the insulating film, and a barrier metal film formed between the insulating film and the metal interconnect,
wherein
the barrier metal film includes a first film, a second film and a third film stacked in this order from a side in which the insulating film exists to a side in which the metal interconnect exists,
the first film contains one metal selected from a group consisting of ruthenium, iridium, molybdernun, osmium, rhodium, platinum, vanadium and palladium, and oxygen,
the second film contains one metal selected from a group consisting of titanium, tantalum, zirconium, niobium, hafnium, tungsten, ruthenium, iridium, molybdenum, osmium, rhodium, platinum and vanadium, and one element selected from a group consisting of nitrogen, carbon and silicon,
the third film contains one metal selected from a group consisting of ruthenium, iridium, molybdenum, osmium, rhodium, platinum, vanadium and palladium, and the barrier metal film has a thickness of 15 nm or less.
2. The semiconductor device of claim 1 , wherein an elasticity of the second film is larger than that of the first film.
3. The semiconductor device of claim 1 , wherein the insulating film contains oxygen.
4. The semiconductor device of claim 1 ,
wherein
the barrier metal film includes a fourth film between the second film and the third film, and
the fourth film contains one metal selected from a group consisting of ruthenium, iridium, molybdenum, osmium, rhodium, platinum, vanadium and palladium, and oxygen.
5. A semiconductor device including an insulating film formed over a substrate, a buried metal interconnect formed in the insulating film, and a barrier metal film formed between the insulating film and the metal interconnect,
wherein
the barrier metal film contains one meal selected frOm a group consisting of
ruthenium, iridium, molybdenum, osmium, rhodium, platinum, vanadium and palladium,
the barrier metal film includes a first region and a second region in this order from a side in which the insulating film exists to a side in which the metal interconnect exists,
a greater quantity of oxygen exists in the first region than in the second region,
a greater quantity of nitrogen exists in the second region than in the first region, and the barrier metal film has a thickness of 15 nm or less.
6. The semiconductor device of claim 5 , wherein an elasticity of the second region is larger than that of the first region.
7. The semiconductor device of claim 5 , wherein the insulating film contains oxygen.
8. The semiconductor device of claim 5 ,
wherein
the barrier metal film further includes a third region at a part located closer to the metal interconnect than the second region, and
a larger quantity of oxygen exists in the third region than in the second region.