Antenna devices having frequency-dependent connection to electrical ground
View Patent ↗Antenna devices and techniques that provide specific control of the spatial distributions of DC and RF signals at various positions in a wireless apparatus are disclosed. The wireless apparatus includes various device components each having specifications for achieving desired operations in antenna devices.
1. A device comprising:
one or more substrates comprising a dielectric material having a first surface and a second surface;
one or more metallization layers located on one or more of the first or second surfaces of the one or more substrates;
a ground electrode formed in one of the one or more metallization layers;
one or more metal plates formed in at least one of the one or more metallization layers;
a plurality of conductive portions formed in at least one of the one or more metallization layers; and
one or more electrical components, electrically coupled to the one or more metal plates and the ground electrode,
wherein the one or more electrical components are structured to produce a frequency-dependent impedance for transmission of a DC signal through the one or more electrical components to the ground electrode and for reduction or suppression of transmission of an antenna signal through the one or more electrical components to the ground electrode, and
wherein the plurality of conductive portions and at least a portion of the one or more substrates are configured to form a composite left and right handed (CRLH) metamaterial structure that exhibits a plurality of frequency resonances associated with the antenna signal.
2. The device as in claim 1 , wherein
a plurality of integrated components is formed in at least one housing of the one or more metal plates.
3. The device as in claim 2 , wherein
the plurality of integrated components includes a plurality of key domes.
4. The device as in claim 2 , wherein
the plurality of integrated components includes a microphone.
5. The device as in claim 1 wherein
at least one of the one or more electrical components is an active electrical component.
6. The device as in claim 1 , wherein
at least one of the one or more electrical components is a passive electrical component.
7. The device claim 6 , wherein
the at least one passive electrical component is an inductor.
8. The device as in claim 1 , wherein:
a first substrate is substantially in parallel with and in proximity to a first planar section of an enclosure structure, the first substrate comprising a first conductive portion,
a second substrate, configured differently from the first substrate, is substantially in parallel with and in proximity to a second planar section of the enclosure structure, the second substrate comprising a second conductive portion, and
a joint section couples the first and second substrates,
wherein the plurality of conductive portions and at least a portion of the first and second substrates are configured to form the composite left and right handed (CRLH) metamaterial structure.
9. The device as in claim 1 , wherein the plurality of conductive portions comprises:
a cell patch;
a feed line having a distal end close to the cell patch, the feed line being capacitively coupled to the cell patch, the feed line having a proximal end coupled to a feed port for directing the antenna signal to and from the cell patch; and
a via line coupling the cell patch to the ground electrode.
10. The device as in claim 9 , wherein
a distal end portion of the feed line forms a launch pad to modify capacitive coupling.
11. The device as in claim 9 , wherein
the feed line includes a conductive line attachment.
12. The device as in claim 11 , wherein
the conductive line attachment is structured to have a meander line shape, a planar spiral shape, a zigzag line shape, a vertical spiral shape, or a combination of different shapes.
13. The device as in claim 9 , wherein the plurality of conductive portions include a via formed between the first metallization layer and the second metallization layer and coupling the cell patch and the via line.
14. The device as in claim 1 , wherein the plurality of conductive portions comprise:
a plurality of cell patches;
a feed line having a distal end close to and capacitively coupled to one or more of the plurality of cell patches and a proximal end coupled to a feed port for directing the antenna signal to and from the one or more of the plurality of cell patches; and
a plurality of via lines coupling the plurality of cell patches respectively to the ground electrode.
15. A wireless device, comprising:
a device enclosure;
a first planar substrate having a first surface and a second surface, different from the first surface;
a ground plane supported by the first and second surfaces of the first planar substrate;
a first metal plate supported by the first surface of the first planar substrate;
a second metal plate supported by the second surface of the first planar substrate;
a plurality of vias formed in the first planar substrate for connecting the first metal plate and the second metal plate;
an electrical component supported by the first surface of the first planer substrate for connecting the first metal plate to the ground plane, wherein an RF frequency source determines an impedance associated with the electrical component;
an antenna section configured to be substantially in parallel with and in proximity to a planar section of the device enclosure, comprising:
a second planar substrate, and
at least one conductive portion associated with the second planar substrate; and
a third planar substrate configured to be substantially in parallel with and in proximity to a planar section of the device enclosure,
wherein the at least one conductive portion forms a composite right and left handed (CRLH) metamaterial structure configured to support at least one frequency resonance in a first antenna signal associated with the antenna section.
16. The wireless device as in claim 15 , wherein the at least one conductive portion comprises:
a cell patch;
a feed line having a distal end close to and capacitively coupled to the cell patch and a proximal end coupled to a feed port for directing the antenna signal to and from the cell patch; and
a via line coupling the cell patch to ground.
17. The wireless device claim 16 , wherein
the via line extends along the edge of the second and third planar substrates.
18. The wireless device claim 15 , wherein
the third planar substrate comprises air.
19. The wireless device claim 15 , wherein
the electrical component comprises a passive or an active electrical component.
20. The wireless device claim 19 , wherein
the passive electrical component comprises an inductor.
21. The device as in claim 9 , wherein the cell patch comprises:
a first cell plate coupled to the via line, the first cell plate is projected over a first metal plate of the one or more metal plates; and
a second cell plate adjacent to the first cell plate and projected over a second metal plate of the one or more metal plates.
22. The wireless device as in claim 21 , wherein the first cell plate and the second cell plate are separated by a slot.
23. The wireless device as in claim 21 , wherein one corner of the second metal plate is structured to have an L-shape cutout.
24. The device as in claim 1 , wherein:
at least one of the one or more electrical components includes a transistor.
25. The device as in claim 1 , wherein:
at least one of the one or more electrical components includes a diode.
26. The device as in claim 1 , comprising:
an electrical unit connected to at least one of the one or more electrical components and electrically isolated from the antenna signal.
27. The device as in claim 26 , wherein:
the electrical unit includes one or more key domes.
28. The device as in claim 26 , wherein:
the electrical unit includes a microphone.
29. The device of claim 9 , wherein the ground electrode is located entirely outside a footprint of the cell patch projected from a metallization layer where the cell patch is located to a layer where the ground electrode is located.
30. The device of claim 14 , wherein the ground electrode is located entirely outside a footprint of the cell patches projected from a metallization layer where the cell patches are located to a layer where the ground electrode is located.