IP Library Granted Patent US 7,968,357
Granted Patent B2
US 7,968,357 · App. 12/662,961 · Granted Jun 28, 2011

Manufacturing method of liquid crystal display device

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Quick Facts
Patent No.
US 7,968,357
App. No.
12/662,961
Granted
Jun 28, 2011
Kind
B2
Abstract

The present invention provides a liquid crystal display device having a large holding capacitance in the inside of a pixel. A liquid crystal display device includes a first substrate, a second substrate arranged to face the first substrate in an opposed manner, and liquid crystal sandwiched between the first substrate and the second substrate. The first substrate includes a video signal line, a pixel electrode, a thin film transistor having a first electrode thereof connected to the video signal line and a second electrode thereof connected to the pixel electrode, a first silicon nitride film formed above the second electrode, an organic insulation film formed above the first silicon nitride film, a capacitance electrode formed above the organic insulation film, and a second silicon nitride film formed above the capacitance electrode and below the pixel electrode. The second silicon nitride film is a film which is formed at a temperature lower than a forming temperature of the first silicon nitride film. The first silicon nitride film and the second silicon nitride film form a contact hole therein by etching both of the first silicon nitride film and the second silicon nitride film collectively by dry etching. The second electrode and the pixel electrode are connected to each other via the contact hole. A potential different from a potential applied to the pixel electrode is applied to the capacitance electrode, and a holding capacitance is formed by the pixel electrode, the second silicon nitride film and the capacitance electrode.

Claims (43)

1. A manufacturing method of a liquid crystal display device comprising the steps of:

forming a thin film transistor having a first electrode thereof connected to a video signal line and a second electrode on a substrate;

forming a first silicon nitride film above the second electrode;

forming an organic insulation film above the first silicon nitride film;

forming a capacitance electrode above the organic insulation film;

forming a second silicon nitride film above the capacitance electrode;

forming a contact hole on the second electrode;

forming a pixel electrode on the second silicon nitride film;

wherein the second silicon nitride film is formed at a temperature lower than a forming temperature of the first silicon nitride film,

the contact hole is formed by etching both of the first silicon nitride film and the second silicon nitride film collectively by dry etching,

the second electrode and the pixel electrode are connected to each other via the contact hole,

a potential different from a potential applied to the pixel electrode is applied to the capacitance electrode, and

a holding capacitance is formed by the pixel electrode, the second silicon nitride film and the capacitance electrode.

2. A manufacturing method of a liquid crystal display device according to claim 1 , wherein the capacitance electrode has at least a portion thereof formed of a reflection film, and

the second electrode is made of a material which is etched by an etchant or an etching gas used in patterning the reflection film.

3. A manufacturing method of a liquid crystal display device according to claim 1 , wherein the second silicon nitride film is formed of a film which exhibits an etching rate in the vicinity of a surface thereof faster than the etching rate in other portion thereof.

4. A manufacturing method of a liquid crystal display device according to claim 3 , wherein a film thickness of a portion of the second silicon nitride film arranged in the vicinity of the surface of the second silicon nitride film which exhibits the etching rate faster than the etching rate of other portion of the second silicon nitride film is set to a value not less than 5% and not more than 30% of a film thickness of the second silicon nitride film.

5. A manufacturing method of a liquid crystal display device according to claim 1 , wherein the second silicon nitride film is a film formed by a plasma CVD method.

6. A manufacturing method of a liquid, crystal display device according to claim 2 , wherein the second electrode includes the same material as the reflection film.

7. A manufacturing method of a liquid crystal display device according to claim 2 , wherein the organic insulation film has a surface unevenness on a portion thereof corresponding to the reflection film, and

the reflection film has a surface unevenness which reflects the surface unevenness of the organic insulation film.

8. A manufacturing method of a liquid crystal display device according to claim 7 , wherein a height of the surface unevenness of the organic insulation film between a crest and a valley is 0.3 μm or less.

9. A manufacturing method of a liquid crystal display device according to claim 1 , wherein, in the contact hole, a lower surface of the second silicon nitride film is brought into contact with an upper surface of the first silicon nitride film at least at one portion of the first silicon nitride film.

10. A manufacturing method of a liquid crystal display device according to claim 1 , wherein, in the contact hole, a lower surface of the second silicon nitride film is brought into contact with an upper surface of the first silicon nitride film over the whole circumference of the contact hole.

11. A manufacturing method of a liquid crystal display device according to claim 1 , wherein, in the contact hole, an end portion of a lower surface of the second silicon nitride film is substantially aligned with an end portion of an upper surface of the first silicon nitride film.

12. A manufacturing method of a liquid crystal display device according to claim 1 , wherein, in the contact hole, an end portion of a lower surface of the second silicon nitride film is retracted from an end portion of an upper surface of the first silicon nitride film.

13. A manufacturing method of a liquid crystal display device according to claim 1 , wherein, in the contact hole, the organic insulation film is not exposed from the second silicon nitride film.

14. A manufacturing method of a liquid crystal display device according to claim 1 , wherein the capacitance electrode has at least a portion thereof formed of a transparent conductive film.

15. A manufacturing method of a liquid crystal display device according to claim 1 , wherein the pixel electrodes is formed of a transparent conductive film.

16. A manufacturing method of a liquid crystal display device according to claim 1 , wherein the capacitance electrode also functions as a counter electrode and the liquid crystal is driven by an electric field generated between the pixel electrode and the counter electrode.

17. A manufacturing method of a liquid crystal display device according to claim 1 , wherein the second substrate includes a counter electrode and the liquid crystal is driven by an electric field generated between the pixel electrode and the counter electrode.

18. A manufacturing method of a liquid crystal display device comprising the steps of:

forming a thin film transistor having a first electrode thereof connected to a video signal line and a second electrode on a substrate;

forming an organic insulation film formed above the second electrode;

forming a capacitance electrode formed above the organic insulation film;

forming a silicon nitride film above the capacitance electrode;

forming a contact hole on the second electrode;

forming a pixel electrode on the silicon nitride film;

wherein the silicon nitride film is formed at a temperature lower than a heat-resistant temperature of the organic insulation film after the formation of the organic insulation film,

the second electrode and the pixel electrode are connected to each other via the contact hole,

a potential different from a potential applied to the pixel electrode is applied to the capacitance electrode, and

a holding capacitance is formed by the pixel electrode, the silicon nitride film and the capacitance electrode.

19. A manufacturing method of a liquid crystal display device according to claim 18 , wherein the silicon nitride film is a film formed by a plasma CVD method.

Assignments (8)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2025
From: JAPAN DISPLAY INC
To: MAGNOLIA PURPLE CORPORATION
Reel/Frame 071890/0202 →
CHANGE OF NAME Recorded Nov 17, 2023
From: HITACHI DISPLAYS, LTD.
To: JAPAN DISPLAY EAST, INC.
Reel/Frame 065614/0223 →
CHANGE OF NAME Recorded Nov 17, 2023
From: JAPAN DISPLAY EAST, INC.
To: JAPAN DISPLAY, INC.
Reel/Frame 065614/0644 →
CHANGE OF ADDRESS Recorded Nov 17, 2023
From: JAPAN DISPLAY, INC.
To: JAPAN DISPLAY, INC.
Reel/Frame 065654/0250 →
NUNC PRO TUNC ASSIGNMENT Recorded Nov 17, 2023
From: PANASONIC LIQUID CRYSTAL DISPLAY CO., LTD.
To: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA
Reel/Frame 065615/0327 →
MERGER Recorded Dec 13, 2011
From: IPS ALPHA SUPPORT CO., LTD.
To: PANASONIC LIQUID CRYSTAL DISPLAY CO., LTD.
Reel/Frame 027482/0140 →
ATTACHED ARE (1) THE COMPANY SPLIT DOCUMENTS IN JAPANESE WITH ENGLISH TRANSLATION THEREOF AND (2) THE CERTIFICATE OF COMPANY SPLIT DOCUMENT IN JAPANESE WITH ENGLISH TRANSLATION, WHICH TOGETHER CONVEY 50% OWNERSHIP OF THE REGISTERED PATENTS AS LISTED IN THE ATTACHED TO EACH OF THE RECEIVING PARTIES (SEE PAGE 10, EXHIBIT 2-1, SECTION 1 OF THE ENGLISH TRANSLATION OF THE COMPANY SPLIT PLAN.) Recorded Dec 13, 2011
From: HITACHI, DISPLAYS, LTD.
To: HITACHI DISPLAYS, LTD.; IPS ALPHA SUPPORT CO., LTD.
Reel/Frame 027615/0589 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 13, 2010
From: TANABE, HIDEO; TAKABATAKE, MASARU; KANEKO, TOSHIKI; HASEGAWA, ATSUSHI; SEHATA, HIROKO
To: HITACHI DISPLAYS, LTD.
Reel/Frame 024420/0058 →