Semiconductor device and a manufacturing method of the same
View Patent ↗In a non-insulated DC-DC converter having a circuit in which a power MOS•FET high-side switch and a power MOS•FET low-side switch are connected in series, the power MOS•FET low-side switch and a Schottky barrier diode to be connected in parallel with the power MOS•FET low-side switch are formed within one semiconductor chip. The formation region SDR of the Schottky barrier diode is disposed in the center in the shorter direction of the semiconductor chip, and on both sides thereof, the formation regions of the power MOS•FET low-side switch are disposed. From the gate finger in the vicinity of both long sides on the main surface of the semiconductor chip toward the formation region SDR of the Schottky barrier diode, a plurality of gate fingers are disposed so as to interpose the formation region SDR between them.
1. A semiconductor device including a DC-DC converter, comprising:
a first die pad having an input power supply terminal;
a second die pad having an output terminal;
a third die pad;
a lead having a reference potential terminal, which is adjacent to the second die pad;
a first semiconductor chip including a high side MOSFET of the DC-DC converter, which is mounted over the first die pad,
the first semiconductor chip having a first gate electrode pad, a first source electrode pad and a first drain electrode of the high side MOSFET,
the first drain electrode being electrically coupled to the input power supply terminal,
the first source electrode pad being electrically coupled to the output terminal;
a second semiconductor chip including a low side MOSFET of the DC-DC converter, which is mounted over the second die pad,
the second semiconductor chip having a second gate electrode pad, a second source electrode pad and a second drain electrode of the low side MOSFET,
the second source electrode pad being electrically coupled to the reference potential terminal,
the second drain electrode being electrically coupled to the output terminal;
a third semiconductor chip including a first driver circuit driving the high side MOSFET and a second driver circuit driving the low side MOSFET, which is mounted over the third die pad,
the third semiconductor chip having a first electrode pad electrically coupled to an output of the first driver circuit and a second electrode pad electrically coupled to an output of the second driver circuit,
a first bonding wire for electrically coupling the first electrode pad of the third semiconductor chip and the first gate electrode pad of the first semiconductor chip;
a second bonding wire for electrically coupling the second electrode pad of the third semiconductor chip and the second gate electrode pad of the second semiconductor chip;
a first metal sheet interconnect coupled to the first source electrode pad of the first semiconductor chip and the second die pad,
the first source electrode pad of the first semiconductor chip and the second drain electrode of the second semiconductor chip being electrically coupled via the first metal sheet interconnect and the second die pad;
a second metal sheet interconnect coupled to the second source electrode pad of the second semiconductor chip and the lead; and
a resin body covering the first, second and third semiconductor chips,
the input power supply terminal being exposed from the resin body,
the reference potential terminal being exposed from the resin body,
the output terminal being exposed from the resin body,
wherein a Schottky Barrier Diode is formed in the second semiconductor chip, and
an anode and a cathode of the Schottky Barrier Diode are electrically coupled to the second source electrode pad and the second drain electrode of the second semiconductor chip, respectively.
2. A semiconductor device according to claim 1 , wherein the second semiconductor chip comprising:
a semiconductor substrate of n-type having a first major surface and a second major surface opposite to the first major surface,
the drain electrode formed over the second major surface and electrically connected to the semiconductor substrate;
an epitaxial layer of n-type formed over the first major surface of the semiconductor substrate and electrically connected to the semiconductor substrate; and
the second source electrode pad formed on the epitaxial layer,
wherein the source electrode pad and the epitaxial layer form a Schottky contact of the Schottky barrier diode.
3. A semiconductor device according to claim 2 , wherein the epitaxial layer is made of silicon; and
the second electrode pad is made of aluminum.
4. A semiconductor device according to claim 2 , wherein the second semiconductor chip includes:
a Schottky barrier diode formation region in which the Schottky barrier diode is formed and a transistor cell formation regions in which the low side MOSFET is formed;
an n-type well formed in the epitaxial layer in the transistor cell formation region, an impurity concentration of the n-type well being greater than that of the epitaxial layer;
a channel formation region of the low side MOSFET formed over the n-type well in the transistor cell formation region, the channel formation region having p-type;
a source region of the low side MOSFET formed over the channel formation region in the transistor cell formation region, the source region having n-type; and
a gate electrode of the low side MOSFET formed over the n-type well in the transistor cell formation region,
wherein the n-type well is not formed in the Schottky barrier diode formation region.
5. A semiconductor device according to claim 1 , wherein the second semiconductor chip has a Schottky barrier diode formation region in which the Schottky barrier diode is formed and a transistor cell formation regions in which the low side MOSFET is formed;
the Schottky barrier diode formation region is located between the transistor cell formation regions.
6. A semiconductor device according to claim 1 , wherein the first and second metal sheet interconnects are made of copper.
7. A semiconductor device according to claim 1 , wherein widths of the first and second metal sheet interconnects are greater than that of the first and second bonding wires.
8. A semiconductor device according to claim 1 , wherein the first semiconductor chip has a rectangular shape having a pair of long sides and a pair of short sides in a plan view; and
the first metal sheet interconnect is disposed so as to overlap with one of the long sides in plan view.
9. A semiconductor device according to claim 8 , wherein the one of the long sides of the first semiconductor chip faces toward the second semiconductor chip.
10. A semiconductor device according to claim 8 , wherein the first semiconductor chip has a pair of the first source electrode pads; and
the first metal sheet interconnect is electrically and mechanically connected to the pair of the first source electrode pads.