Packaged device with acoustic transducer and amplifier
View Patent ↗A device includes: a lead frame having an aperture in a central portion thereof; at least one acoustic transducer mounted on the lead frame above the aperture and configured to convert between acoustic energy and an electrical signal with low signal losses; a housing connected to the lead frame and including a base portion on a same side of the lead frame as the acoustic transducer; an amplifier is provided on a base portion of the housing in close proximity to the acoustic transducer; and a lid configured together with the base portion of the housing to define a cavity, wherein the acoustic transducer and the amplifier are closely positioned within the MEMS device cavity.
1. A device, comprising:
an electrically conductive lead frame having an aperture therethrough;
a semiconductor die mounted on the lead frame, and including at least one acoustic transducer disposed above the aperture and configured to convert between acoustic energy and an electrical signal;
an acoustic horn integrally connected to the lead frame, the horn extending from the lead frame and comprising a throat positioned adjacent to the acoustic transducer and a mouth opening at an opposite end of the acoustic horn from the throat;
a substrate mounted on a base portion of the acoustic horn;
an amplifier mounted on the substrate and being electrically connected to the acoustic transducer; and
a lid configured together with a base portion of a housing to define a cavity, wherein the acoustic transducer and the amplifier are positioned within the cavity.
2. The device of claim 1 , wherein the amplifier comprises an operational amplifier fabricated as an integrated circuit and one or more external components for configuring an operating parameter of the operational amplifier.
3. The device of claim 1 , further including at least one bond wire connected between a pad on the substrate and at least one lead of the lead frame.
4. The device of claim 1 , further including at least one bond wire connected between a pad on the substrate and a pad on the semiconductor die.
5. The device of claim 1 , wherein the acoustic transducer comprises a micro electro-mechanical system (MEMS) transducer.
6. The device of claim 1 , wherein the cavity is hermetically sealed.
7. The device of claim 1 , wherein the acoustic horn comprises plastic transfer molded through a portion of the lead frame and extending from the lead frame to the mouth of the horn.
8. The device of claim 1 , wherein the substrate is a printed circuit substrate attached to the housing by glue.
9. The device of claim 8 , wherein the substrate comprises alumina ceramic material.
10. A device, comprising:
an electrically conductive lead frame having an aperture therethrough;
at least one acoustic transducer mounted on the lead frame above the aperture and configured to convert between acoustic energy and an electrical signal;
a housing connected to the lead frame and including a base portion on a same side of the lead frame as the acoustic transducer, wherein the housing comprises an acoustic horn having a first opening at an end where the housing is connected to the lead frame, the first opening surrounding the aperture in the lead frame, and having a second opening at an opposite end of the acoustic horn from the first opening, wherein a diameter of the second opening is greater than a diameter of the first opening;
an amplifier provided on a base portion of the housing; and
a lid configured together with the base portion of the housing to define a cavity, wherein the acoustic transducer and the amplifier are positioned within the cavity.
11. The device of claim 10 , further comprising a printed circuit substrate mounted on the base portion of the housing, wherein the amplifier is mounted on the printed circuit substrate.
12. The device of claim 10 , wherein the amplifier comprises an operational amplifier fabricated as an integrated circuit and one or more external components for configuring an operating parameter of the operational amplifier.
13. The device of claim 10 , further including at least one bond wire connected between a pad on the substrate and at least one lead of the lead frame.
14. The device of claim 10 , further including at least one bond wire connected between a pad on the substrate and a pad on the semiconductor die.
15. The device of claim 10 , wherein the acoustic transducer comprises a micro electro-mechanical system (MEMS) transducer.
16. The device of claim 10 , wherein the cavity is hermetically sealed.
17. The device of claim 10 , wherein the housing comprises plastic transfer molded through a portion of the lead frame.
18. The device of claim 10 , wherein the acoustic transducer is disposed on a semiconductor die.