Manufacturing method of semiconductor device
View Patent ↗In MOSFET having SBD as a protection element, a TiW (alloy having tungsten as a main component) film is used as an aluminum-diffusion barrier metal film below an aluminum source electrode in order to secure properties of SBD. The present inventors have found that a tungsten-based barrier metal film is in the form of columnar grains having a lower barrier property than that of a titanium-based barrier metal film such as TiN so that aluminum spikes are generated relatively easily in a silicon substrate. In the present invention, when a tungsten-based barrier metal film is formed by sputtering as a barrier metal layer between an aluminum-based metal layer and a silicon-based semiconductor layer therebelow, the lower layer is formed by ionization sputtering while applying a bias to the wafer side and the upper layer is formed by sputtering without applying a bias to the wafer side.
1. A manufacturing method of a semiconductor device comprising the steps of:
(a) providing a wafer stage;
(b) supporting a semiconductor wafer, having a first surface, on the wafer stage;
(c) providing an insulating film formed over the first surface of the semiconductor wafer and having an insulating film upper surface;
(d) forming a recess extending downwards from the insulating film upper surface and with the so-formed recess having a recess inner surface;
(e1) forming a first-layer film of a tungsten-containing barrier metal film and having a first-layer film inner surface directly contacting the recess inner surface of the recess and also directly contacting the upper surface of the first insulating film and having a first-layer film outer surface;
(e2) forming the first-layer film of the tungsten-containing barrier metal film using ionization sputtering film formation while applying a bias voltage to the semiconductor wafer resulting in the first-layer film of the tungsten-containing barrier metal film having an amorphous structure with barrier properties;
(e3) forming a second-layer film of the tungsten-containing barrier metal film having a second-layer film inner surface directly contacting the outer surface of the first-layer film of the tungsten-containing barrier metal film and having a second-layer film outer surface;
(e4) forming the second-layer film of the tungsten-containing barrier metal film using ionization sputtering film formation, without substantially applying a bias voltage to the semiconductor wafer resulting in the second-layer film of the tungsten containing barrier metal film having a columnar crystal structure with a reflow property to aluminum;
(f) after the steps (e1), (e2), (e3) and (e4), forming a seed aluminum-containing metal film having an inner surface covering the outer surface of the second-layer tungsten-containing barrier metal film which was formed over the first layer film of the tungsten-containing barrier metal film directly contacting the inner surface of the recess and the upper surface of the first insulating film, with the seed aluminum-containing metal film having an upper surface;
(g) forming the seed aluminum-containing metal film using ionization sputtering film formation, while applying a bias voltage to the semiconductor wafer, and while setting a temperature of the wafer stage between 400° C. and 440° C., resulting in the seed aluminum-containing metal film not closing an upper portion of the recess; and
(h) forming an aluminum-containing metal film covering the upper surface of the seed aluminum-containing metal film using ionization sputtering film formation, without substantially applying a bias voltage to the semiconductor wafer resulting in the aluminum-containing metal film filling the recess and covering the second-layer film of the tungsten-containing barrier metal film outside the recess.
2. The manufacturing method of a semiconductor device according to claim 1 , further including providing the tungsten-containing barrier metal film containing tungsten as a first component thereof and titanium as a second component thereof.
3. The manufacturing method of a semiconductor device according to claim 1 , further including performing steps (e1), (e2), (e3), (e4), (f) and (g) in a single film forming chamber.
4. The manufacturing method of a semiconductor device according to claim 1 , further including performing the steps (e1), (e2), (e3), (e4), (f) and (g) in film forming chambers different from each other.
5. The manufacturing method of a semiconductor device according to claim 1 , wherein the semiconductor wafer has, over the first surface thereof, a number of semiconductor chip regions, and further has a Schottky barrier diode formed in each of the number of semiconductor chip regions.
6. The manufacturing method of a semiconductor device according to claim 1 , wherein a power MOSFET is formed in each of the number of semiconductor chip regions.
7. The manufacturing method of a semiconductor device according to claim 1 , wherein the recess has a two-stage structure.