On-die bond wires system and method for enhancing routability of a redistribution layer
View Patent ↗An integrated circuit includes a first die and a second die positioned in a package. The first die has a redistribution layer formed on the die and including a plurality of relocated bond pads. The relocated bond pads are positioned near an inner edge of the first die that is adjacent to an inner edge of the second die. Each relocated bond pad is coupled to a corresponding bond pad on the second die through a respective bonding wire. The first die further includes a plurality of original bond pads. The redistribution layer further includes at least one intermediate bond pad electrically interconnected through a respective conductive trace to a corresponding original bond pad. Each intermediate bond pad is electrically connected to a corresponding relocated bond pad through a respective bond wire.
1. A method comprising:
providing (i) a first die comprising a first bond pad and (ii) a second die comprising a second bond pad, wherein a redistribution layer is formed on the second die;
forming a third bond pad in the redistribution layer, the third bond pad being positioned to provide electrical interconnection via a first bonding wire to the first bond pad of the first die;
forming a pair of intermediate bond pads in the redistribution layer, the pair of intermediate bond pads including (i) a first intermediate bond pad electrically interconnected via a first conductive trace to the second bond pad and (ii) a second intermediate bond pad electrically interconnected via a second conductive trace to the third bond pad; and
electrically interconnecting the first intermediate bond pad to the second intermediate bond pad using a second bonding wire.
2. The method of claim 1 , wherein the first die is stacked on top of the second die.
3. The method of claim 1 , wherein the first die and the second die are positioned side-by-side.
4. The method of claim 3 , wherein forming a third bond pad in the redistribution layer comprises forming the third bond pad along an inner edge of the second die, the inner edge of the second die being positioned adjacent to an inner edge of the first die.
5. The method of claim 1 , wherein the third bond pad is configured to communicate one or more of (i) control signals, (ii) address signals, and (iii) data signals between the first die and the second die.
6. The method of claim 1 , further comprising:
arranging the first die and the second die within a lead frame package.
7. The method of claim 6 , wherein the lead frame package comprises a quad flat package (QFP).
8. The method of claim 7 , wherein:
the QFP includes a lead frame having a die paddle; and
each of the first die and the second die is mounted to the die paddle.
9. The method of claim 6 , wherein the package comprises a ball grid array package.
10. The method of claim 1 , wherein:
the first die includes memory circuitry; and
the second die includes memory controller circuitry.
11. The method of claim 1 , further comprising arranging the first die and the second die in a system in package (SIP).
12. The method of claim 1 , further comprising a third die including another redistribution layer, the another redistribution layer of the third die including (i) a relocated bond pad and (ii) an intermediate bond pad connected through another bonding wire.