Manufacturing method for electronic devices
View Patent ↗A manufacturing method for an electronic device joining a first metallic bond part formed on a first electronic component and a second metallic bond part formed on a second electronic component includes a first process for placing the first metallic bond part directly against the second metallic bond part, applying pressure to the first electronic component and the second electronic component, joining the first metallic bond part to the second metallic bond part with solid-phase diffusion, and releasing the applied pressure, and a second process for heating the first electronic component and the second electronic component at a predetermined temperature such that the first metallic bond part and the second metallic bond part are joined together by melting the first metallic bond part and the second metallic bond part.
1. A manufacturing method for an electronic device joining a first metallic bond part formed on a first electronic component and a second metallic bond part formed on a second electronic component, the manufacturing method comprising:
a first process for:
placing the first metallic bond part directly against the second metallic bond part;
applying pressure to the first electronic component and the second electronic component;
joining the first metallic bond part to the second metallic bond part with solid-phase diffusion; and
releasing the applied pressure; and
a second process for:
heating the first electronic component and the second electronic component at a predetermined temperature such that the first metallic bond part and the second metallic bond part are joined together by melting the first metallic bond part and the second metallic bond part.
2. The manufacturing method according to claim 1 , further comprising:
forming the first electronic component on a support piece before the first process.
3. The manufacturing method according to claim 2 , wherein the support piece has a heat expansion coefficient near a heat expansion coefficient of the second electronic component.
4. The manufacturing method according to claim 2 , wherein a heat expansion coefficient of the support piece is the same as a heat expansion coefficient of the second electronic component.
5. The manufacturing method according to claim 2 , wherein the support piece and the second electronic component comprise a same material.
6. The manufacturing method according to claim 2 , wherein the support piece comprises a substrate comprising a silicon wafer, glass, or ceramic materials.
7. The manufacturing method according to claim 2 , wherein the second electronic component comprises a semiconductor chip, the semiconductor chip comprising a through-silicon via.
8. The manufacturing method according to claim 2 , wherein the second electronic component comprises a plurality of semiconductor chips, the semiconductor chips being stacked on each other, and
wherein each of the semiconductor chips comprises a through-silicon via.
9. The manufacturing method according to claim 8 , wherein said through-silicon via is connected to through-silicon vias of other semiconductor chips.
10. The manufacturing method according to claim 2 , further comprising:
mounting the first electronic component and the support piece on a heating stage.
11. The manufacturing method according to claim 1 , further comprising:
clamping the second electronic component to the first electronic component, prior to said applying pressure.
12. The manufacturing method according to claim 1 , wherein the first electronic component comprises a wiring piece comprising alternate laminations of insulating layers and wiring layers.
13. The manufacturing method according to claim 1 , wherein the first metallic bond part is formed on a surface of the first electronic component.
14. The manufacturing method according to claim 1 , further comprising:
mounting a plurality of laminated pieces of the second electronic component adjacently on a surface of the first electronic component.
15. The manufacturing method according to claim 14 , further comprising:
press heating said plurality of laminated pieces of the second electronic component mounted on the surface of the first electronic component.
16. The manufacturing method according to claim 15 , wherein said press heating comprises:
applying pressure to a support piece of the first electronic component, the first electronic component, and said plurality of laminated pieces, to simultaneously clamp the first electronic component and said plurality of laminated pieces in their relative positions.