IP Library Granted Patent US 7,876,414
Granted Patent B2
US 7,876,414 · App. 12/830,858 · Granted Jan 25, 2011

Liquid crystal display device, method for fabricating the same, and portable telephone using the same

Assignee: Renesas Electronics Corporation
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Quick Facts
Patent No.
US 7,876,414
App. No.
12/830,858
Granted
Jan 25, 2011
Kind
B2
Abstract

A liquid crystal display device comprises a liquid crystal display panel and a semiconductor integrated circuit for driving and controlling the liquid crystal display panel. The number of input/output wires connected to I/O terminals (bonding pads) of the semiconductor integrated circuit is reduced so as to simplify wiring patterns of the I/O wires, whereby degrees of freedom in arranging the I/O wiring patterns are enhanced. The panel has a pair of insulating substrate, and the semiconductor integrated circuit is mounted on one of the paired substrates. The semiconductor integrated circuit has a mode terminal which is fixed to a power supply potential or to a reference potential during operation of the integrated circuit, and power supply dummy terminals connected to the power supply potential or reference potential inside the semiconductor integrated circuit. The wiring patterns formed on the paired insulating substrates connect the mode terminal to the power supply dummy terminals.

Claims (27)

1. A method of manufacturing a liquid crystal display device, comprising steps of:

(a) preparing a liquid crystal display panel having a plurality of conductive patterns;

(b) preparing a semiconductor integrated circuit device for controlling and driving the liquid crystal display panel, and the semiconductor integrated circuit device has long sides and short sides; and

(c) mounting the semiconductor integrated circuit device on the liquid crystal display panel,

wherein the semiconductor integrated circuit device comprises:

a plurality of first terminals for outputting a liquid crystal driving voltage;

a second terminal for receiving a power supply potential or a reference potential from outside of the semiconductor integrated circuit device;

a third terminal connected to the second terminal by a wiring formed inside of the semiconductor integrated circuit device; and

a fourth terminal fixed to the power supply potential or the reference potential via the third terminal during operation of the semiconductor integrated circuit device,

wherein the distance between the third terminal and the fourth terminal is shorter than the distance between the second terminal and the fourth terminal,

wherein the fourth terminal is a terminal to select different operational modes based on whether to receive the power supply potential or to receive the reference potential,

wherein the first terminals are arranged along one of the long sides,

wherein the second, third and fourth terminals are arranged along another of the long sides,

wherein each of the first, second, third and fourth terminals includes a bump,

wherein the second terminal is connected with one of the conductive patterns, and

wherein the third terminal is connected with the fourth terminal by another of the conductive patterns.

2. A method of manufacturing a liquid crystal display device according to claim 1 ,

wherein the one of the conductive patterns is not connected to any other terminals of the semiconductor integrated circuit device except the third and fourth terminals.

3. A method of manufacturing a liquid crystal display device according to claim 1 ,

wherein the liquid crystal display panel includes a glass substrate, and

wherein the conductive patterns are formed on the glass substrate.

4. A method of manufacturing a liquid crystal display device according to claim 1 ,

wherein each of the conductive patterns is made of a transparent conductive film.

5. A method of manufacturing a liquid crystal display device according to claim 1 ,

wherein the different operational modes are an I2C bus interface mode and a serial interface mode.

6. A method of manufacturing a liquid crystal display device according to claim 1 ,

wherein the bump is formed of a material including Au.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 20, 2024
From: SYNAPTICS JAPAN GK
To: SYNAPTICS INCORPORATED
Reel/Frame 067793/0211 →
CHANGE OF NAME Recorded Aug 8, 2016
From: SYNAPTICS DISPLAY DEVICES GK
To: SYNAPTICS JAPAN GK
Reel/Frame 039711/0862 →
CHANGE OF NAME Recorded May 29, 2015
From: RENESAS SP DRIVERS INC.
To: SYNAPTICS DISPLAY DEVICES KK
Reel/Frame 035796/0947 →
CHANGE OF NAME Recorded May 29, 2015
From: SYNAPTICS DISPLAY DEVICES KK
To: SYNAPTICS DISPLAY DEVICES GK
Reel/Frame 035797/0036 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 19, 2014
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS SP DRIVERS INC.
Reel/Frame 033778/0137 →
Continuity (4)
Continuation 1109955800 · Apr 6, 2005
Division 0998314200 · Oct 23, 2001
Continuation 0926902200
Related Publication 20100273386A1 · Oct 28, 2010