IP Library Granted Patent US 8,529,816
Granted Patent B2
US 8,529,816 · App. 12/898,449 · Granted Sep 10, 2013

Mold frames and cavities for making dimpled golf balls

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Quick Facts
Patent No.
US 8,529,816
App. No.
12/898,449
Granted
Sep 10, 2013
Kind
B2
Abstract

Universal mold frames for producing multi-piece golf balls are provided. The mold frames include lower and upper frame plates having locator pins that are inserted into corresponding locator slots in the mold cavities. The eccentric pin layout of the frame plates and corresponding slots in the cavities means the cavities can be fitted easily and aligned in the frame plates. The interior surfaces of the mold cavities define a specific dimple pattern such as icosahedron or tetrahedron-based patterns. The mold frames can accommodate cavities having different dimple patterns. A castable liquid polymer, for example, polyurethane is dispensed into the mold cavities, which are then pressed together to form the spherical cover for the ball.

Claims (26)

1. A method of molding a golf ball, comprising the steps of:

providing a lower mold frame plate having multiple annular recesses for receiving mold cavities, each recess having a rim wherein at least two locator pins are arranged thereon for inserting into corresponding locator slots of a mold cavity;

providing an upper mold frame plate having multiple annular recesses for receiving mold cavities, each recess having a rim wherein at least one locator pin is arranged thereon for inserting into at least one corresponding locator slot of a mold cavity, each mold cavity in the lower and upper frame plates having an arcuate inner surface defining an inverted dimple pattern;

dispensing a polymeric material into at least one mold cavity; loading a golf ball sub-assembly into at least one mold cavity; attaching the lower and upper plates so that the mold cavities in the lower frame plate are mated to the mold cavities in the upper frame plate under compressive force to form a spherical cover over the golf ball sub-assembly;

and detaching the lower and upper frame plates and removing the molded golf ball from the mold cavities.

2. The method of claim 1 , wherein the lower and upper frame plates each contains four annular recesses for receiving four mold cavities.

3. The method of claim 1 , wherein each annular recess in the lower frame has two locator pins arranged on its rim and each annular recess in the upper mold frame has a single locator pin arranged on its rim.

4. The method of claim 3 , wherein the two locator pins are positioned symmetrically about a first axis that intersects the center of the annular recesses in the lower frame plate, and the single locator pin is positioned on a second axis that intersects the annular recesses in the upper frame plate, the first and second axes being identical.

5. The method of claim 4 , wherein the two locator pins have the same diameter, each pin having a diameter of ≦0.125 inches.

6. The method of claim 5 , wherein the relationship of the diameter of the two locator pins (dp) and diameter of the single locator pin (Dp) is defined according to the following relationship:

dp<Dp≦1.25dp.

7. The method of claim 1 , wherein the two locator pins are separated by a separation angle in the range of about 10 to about 45 degrees.

8. The method of claim 1 , wherein each mold cavity contains three locator slots so that a mold cavity may be inserted into the lower or upper mold frame plate and secured in place by the locator pins.

9. The method of claim 1 , wherein each mold cavity has two locator slots having a diameter (ds), the diameter of the two locator slots (ds) and diameter of the two locator pins (dp) that are inserted into the two locator slots being defined in inches according to the following relationship:

dp+0.001≦ds≦dp+0.010.

10. The method of claim 1 , wherein each mold cavity has a single locator slot having a diameter (Ds), the diameter of the locator slot (Ds) and diameter of the locator pin (Dp) that is inserted into the locator slot being defined in inches according to the following relationship:

Dp+0.001≦Ds≦Dp+0.010.

11. The method of claim 1 , wherein the dimple pattern of each mold cavity is icosahedron-shaped.

12. The method of claim 11 , wherein each mold cavity has two locator slots having a diameter (ds) and a single locator slot having a diameter (Ds), wherein the rotation angle between the two locator slots having diameter (ds) and single locator slot having diameter (Ds) is about 180 or about 186 degrees.

13. The method of claim 1 , wherein the dimple pattern of each mold cavity is tetrahedron-shaped.

14. The method of claim 13 , wherein each mold cavity has two locator slots having a diameter (ds), and a single locator slot having a diameter (Ds), wherein the rotation angle between the two locator slots having diameter (ds) and single locator slot having diameter (Ds) is about 90 degrees.

15. The method of claim 1 , wherein each mold frame plate contains two cut-out cavity hold areas for placing retaining means to secure the mold cavities in place, the cut-out areas being located on an axis extending through the center of each frame plate.

16. The method of claim 15 , wherein the position of a locator pin to an adjacent cavity hold area is defined by a proximity angle of less than 75 degrees.

17. The method of claim 1 , wherein each annular recess in the lower mold frame plate has three locator pins arranged on its rim, and each annular recess in the upper mold frame plate has a single locator pin arranged on its annular rim.

18. The method of claim 1 , wherein each annular recess in the lower mold frame plate has three locator pins arranged on its rim, and each annular recess in the upper mold frame plate has two locator pins arranged on its rim.

19. The method of claim 1 , wherein each annular recess in the lower mold frame plate has two locator pins arranged on its rim, and each annular recess in the upper mold frame plate has three locator pins arranged on its annular rim.

Assignments (7)
ASSIGNMENT OF SECURITY INTEREST IN PATENTS (ASSIGNS 039506-0030) Recorded Aug 3, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS RESIGNING ADMINISTRATIVE AGENT
To: JPMORGAN CHASE BANK, N.A., AS SUCCESSOR ADMINISTRATIVE AGENT
Reel/Frame 061521/0414 →
SECURITY INTEREST Recorded Aug 3, 2022
From: ACUSHNET COMPANY
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 061099/0236 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (027345/0877) Recorded Sep 7, 2016
From: KOREA DEVELOPMENT BANK, NEW YORK BRANCH
To: ACUSHNET COMPANY
Reel/Frame 039939/0087 →
SECURITY INTEREST Recorded Jul 28, 2016
From: ACUSHNET COMPANY
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 039506/0030 →
SECURITY AGREEMENT Recorded Dec 8, 2011
From: ACUSHNET COMPANY
To: KOREA DEVELOPMENT BANK, NEW YORK BRANCH
Reel/Frame 027345/0877 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 14, 2010
From: MADSON, MICHAEL R.; NARDACCI, NICHOLAS M.; VERRONNEAU, MARK R.; MYDLACK, THOMAS L.
To: ACUSHNET COMPANY
Reel/Frame 025135/0764 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 14, 2010
From: MADSON, MICHAEL R.; NARDACCI, NICHOLAS M.; VERRONNEAU, MARK R.; MYDLACK, THOMAS L.
To: ACUSHNET COMPANY
Reel/Frame 025135/0744 →