Electrostatic bonding of a die substrate to a package substrate
View Patent ↗A transducer apparatus comprises a package substrate and a transducer disposed over a die substrate. The die substrate is disposed over the package substrate. The transducer apparatus also comprises a voltage source connected between the die substrate and the package substrate, and configured to selectively apply an electrostatic attractive force between the die substrate and the package substrate.
1. A transducer apparatus, comprising:
a package substrate;
a transducer disposed over a die substrate, wherein the die substrate is disposed over the package substrate; and
a voltage source connected between the die substrate and the package substrate, and configured to selectively apply an electrostatic attractive force between the die substrate and the package substrate.
2. A transducer apparatus as claimed in claim 1 , wherein the voltage source is configured to provide a time dependent voltage.
3. A transducer apparatus as claimed in claim 2 , wherein the time dependent voltage is a square wave voltage.
4. A transducer apparatus as claimed in claim 1 , wherein the voltage source is configured to provide a substantially constant voltage.
5. A transducer apparatus as claimed in claim 1 , further comprising a controller configured to provide input signals to the voltage source, wherein the input signals are configured to selectively change a voltage provided by the voltage source.
6. A transducer apparatus as claimed in claim 5 , further comprising a sensor configured to measure an operating frequency of the transducer and to provide a signal indicative of the measured operating frequency to the controller.
7. A transducer apparatus as claimed in claim 6 , wherein the controller, based on the signal from the sensor, is configured to provide an input signal to the controller to terminate the electrostatic attractive force.
8. A transducer apparatus as claimed in claim 1 , wherein the transducer comprises a micro-electromechanical systems (MEMS) transducer.
9. A transducer apparatus as claimed in claim 8 , wherein the MEMS transducer comprises a piezoelectric micro-electromechanical ultrasonic transducer (PMUT).