Modular distributed components for LED backlight
View Patent ↗A system for powering an LED backlight where power assemblies have electrical communications ran through pass through apertures in a mounting plate and LED backlight panel. A channel may be defined between the mounting plate and the LED backlight panel (or optional thermal plate attached to the rear portion of the LED backlight panel). Sub-channels can be created within the channel which are defined by ribs which connect between the mounting plate and the LED backlight panel (or optional thermal plate attached to the rear portion of the LED backlight panel). Cooling air can be prevented from entering one or more specific sub-channels so that electrical connections can pass through the mounting plate, LED backlight panel, and sub-channel without the risk of cooling air contaminates entering one of the pass through apertures.
1. A LED backlight system comprising:
a printed circuit board (PCB) having a front and rear side;
a plurality of LEDs on the front side of the PCB;
a mounting plate adjacent to the rear side of the PCB;
an electrical power assembly mounted to the mounting plate;
a first pass through aperture located on the PCB;
a second pass through aperture located on the mounting plate; and
electrical connections between the power assembly and LEDs which pass through the first and second pass through apertures.
2. The LED backlight system of claim 1 further comprising:
a thermally conductive plate attached to the rear side of the PCB; and
a fan positioned to force cooling air over the thermally conductive plate.
3. The LED backlight system of claim 1 further comprising:
a cooling channel defined by the space between the rear side of the PCB and the mounting plate; and
a fan positioned to draw cooling air through the cooling channel.
4. The LED backlight system of claim 3 further comprising:
a sub-channel within the cooling channel and containing the first and second pass through holes and electrical connections.
5. The LED backlight system of claim 4 wherein:
the sub-channel is defined by the rear side of the PCB, mounting plate, and a pair of ribs which connect between the rear side of the PCB and mounting plate.
6. The LED backlight system of claim 4 further comprising:
a blocking device placed within the sub-channel to block cooling air from passing through the sub-channel.
7. The LED backlight system of claim 5 wherein:
the pair of ribs are thermally conductive and in thermal communication with the rear side of the PCB.
8. A LED backlight system comprising:
a plurality of LEDs mounted on a substrate having a front and rear side;
a mounting plate spaced apart from the rear side of the substrate and substantially parallel to the substrate;
a plurality of ribs interposed between the mounting plate and rear side of the substrate and in thermal communication with the substrate;
a fan positioned to draw cooling air between the plate and substrate and along the ribs;
an electrical power assembly mounted to the mounting plate;
a first pass through aperture located on the substrate;
a second pass through aperture located on the mounting plate; and
electrical connections between the power assembly and LEDs which pass through the first and second pass through apertures.
9. The LED backlight system of claim 8 wherein:
the substrate is a metal core printed circuit board.
10. The LED backlight system of claim 8 wherein:
the ribs are metallic.
11. The LED backlight system of claim 8 further comprising:
one rib which contains a hollow cross-section that is aligned with the first and second pass through apertures so that the electrical connections may pass through the hollow cross-section of the rib.
12. The LED backlight system of claim 8 wherein:
the first and second apertures are located between a pair of ribs.
13. The LED backlight system of claim 12 further comprising:
a blocking device placed between the pair of ribs which contain the first and second apertures to prevent cooling air from passing through.