Module for containing an earpiece for an audio device
A module for containing an earpiece for an audio device, the earpiece having at least one protruding electrical contact. The module comprises a first portion and a second portion, the first portion and the second portion being opposable and forming a cavity sized to accommodate an earpiece. The module further comprises at least one electrical contact within the cavity, on one of the first portion and the second portion. The electrical contact is positioned to engage a protruding electrical contact of the earpiece positioned within the cavity.
1. A module for containing an earpiece for an audio device, the earpiece having at least one protruding electrical contact exerting a spring force, the module comprising:
a first portion and a second portion, the first portion and the second portion being opposable and forming a cavity sized to accommodate at least a portion of the earpiece; and
at least one electrical contact within the cavity on one of the first portion and second portion, positioned to engage the protruding electrical contact of the earpiece positioned within the cavity, wherein the spring force exerted by the protruding electrical contact is borne by the module and is contained within the cavity formed by the module.
2. The module of claim 1 , wherein the first portion and the second portion are opposably engageable.
3. The module of claim 1 , wherein the first portion and the second portion comprise a plastic material capable of being melted and re-solidifying to couple the first and second portions together.
4. The module of claim 1 , wherein one of the first portion and the second portion comprises at least one plastic heat stake and the other of the first portion and the second portion comprises at least one plastic aperture sized to receive the at least one heat stake.
5. The module of claim 1 , further comprising:
at least one other electrical contact outside the cavity; and
a circuit establishing an electrical connection between the at least one electrical contact within the cavity and the at least one other electrical contact outside the cavity.
6. The module of claim 5 , wherein the circuit comprises a flexible printed circuit board.
7. The module of claim 1 , further comprising at least one mounting apparatus for mounting the module within an audio device.
8. The module of claim 7 , wherein the mounting apparatus comprises at least one hole for receiving a mounting screw.
9. The module of claim 7 , wherein the mounting apparatus comprises at least one heat stake.
10. The module of claim 7 , wherein the mounting apparatus comprises at least one aperture sized to receive a heat stake provided within an audio device.
11. The module of claim 1 , further comprising an audio aperture formed in one of the first portion and the second portion for facilitating the transmission of sound from the earpiece to the exterior of the cavity.
12. The module of claim 11 , further comprising a mesh extending over the audio aperture.
13. The module of claim 1 , further comprising a GPS antenna mounted to one of the first portion and the second portion.
14. The module of claim 1 , further comprising an indicator light guide mounted to one of the first portion and the second portion.