IP Library Patent Application 13024834
Patent Application
App. No. 13/024,834

LED CIRCUIT WITH ZENER DIODES

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Quick Facts
Patent No.
US None
App. No.
13/024,834
Abstract

A light emitting diode (LED) circuit having a plurality of LEDs electrically connected in series with a zener diode electrically connected to each LED in parallel. If an LED were to fail, the current can be routed around the failed LED, through the zener diode, and continue through the rest of the LEDs in the series connection. Thus, a failure in one LED does not cause the entire series string to lose their illumination. Some embodiments may place several LED strings in parallel with one another. Exemplary embodiments may mount the LCDs on a metal core printed circuit board (PCB). Further embodiments may place a thin metallic sheet or metallic surface on the rear surface of the PCB and in thermal communication with the PCB and/or LEDs.

Claims (49)

1 . An LED circuit comprising:

a first plurality of LEDs electrically connected in series; and

a zener diode electrically connected in parallel to each of the first plurality of LEDs.

2 . The LED circuit of claim 1 further comprising:

a first current source in electrical communication with the LEDs and zener diodes.

3 . The LED circuit of claim 2 further comprising:

a second plurality of LEDs electrically connected in series to each other;

a zener diode connected in parallel to each of the second plurality of LEDs; and

a second current source in electrical communication with the second plurality of LEDs and zener diodes;

wherein the second plurality of LEDs and second current source are connected in parallel to the first plurality of LEDs and first current source.

4 . A lighting assembly comprising:

a printed circuit board (PCB) having oppositely facing front and rear surfaces;

a first plurality of LEDs mounted to the front surface of the PCB and electrically connected with each other in series;

a second plurality of LEDs electrically connected in parallel to the first plurality of LEDs and mounted to the front surface of the PCB and electrically connected with each other in series; and

a zener diode electrically connected in parallel to each LED and mounted on the front surface of the PCB.

5 . The lighting assembly of claim 4 wherein:

the PCB is a metal core PCB.

6 . The lighting assembly of claim 4 further comprising:

a first current source in electrical communication with the first plurality of LEDs and the associated zener diodes; and

a second current source in electrical communication with the second plurality of LEDs and the associated zener diodes.

7 . The lighting assembly of claim 6 further comprising:

a light diffusing element placed in front of the PCB.

8 . The lighting assembly of claim 4 wherein:

the rear surface of the PCB is metallic.

9 . The lighting assembly of claim 4 further comprising:

an aluminum plate in thermal communication with the rear surface of the PCB.

10 . The lighting assembly of claim 9 further comprising:

a heat sink in thermal communication with the aluminum plate.

11 . A liquid crystal display comprising:

a pair of transparent substrates with liquid crystal material sandwiched in between;

an electric controlling element placed between the transparent substrates;

a rear polarizer placed behind the transparent substrates;

a front polarizer placed in front of the transparent substrates;

a backlight placed behind the rear polarizer and having:

a printed circuit board (PCB) having oppositely facing front and rear surfaces,

a first plurality of LEDs mounted to the front surface of the PCB and electrically connected with each other in series,

a second plurality of LEDs electrically connected in parallel to the first plurality of LEDs and mounted to the front surface of the PCB and electrically connected with each other in series,

a zener diode electrically connected in parallel to each LED and mounted on the front surface of the PCB,

a first current source in electrical communication with the first plurality of LEDs and the associated zener diodes, and

a second current source in electrical communication with the second plurality of LEDs and the associated zener diodes; and

a light diffusing element placed between the rear polarizer and the backlight.

12 . The liquid crystal display of claim 11 wherein:

the PCB is a metal core PCB.

13 . The liquid crystal display of claim 11 wherein:

the rear surface of the PCB is metallic.

14 . The liquid crystal display of claim 11 further comprising:

an aluminum plate in thermal communication with the rear surface of the PCB.

15 . The liquid crystal display of claim 14 further comprising:

a heat sink in thermal communication with the aluminum plate.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Jun 15, 2018
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: MANUFACTURING RESOURCES INTERNATIONAL, INC
Reel/Frame 047227/0329 →
SECURITY AGREEMENT Recorded Nov 4, 2011
From: MANUFACTURING RESOURCES INTERNATIONAL, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 027175/0973 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 29, 2011
From: DUNN, WILLIAM; WILLIAMS, DAVID
To: MANUFACTURING RESOURCES INTERNATIONAL, INC.
Reel/Frame 026991/0134 →